Patent Assignment Details
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Reel/Frame: | 010418/0034 | |
| Pages: | 2 |
| | Recorded: | 11/22/1999 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/20/2001
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Application #:
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09444365
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Filing Dt:
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11/22/1999
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Title:
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BALL GRID ASSEMBLY TYPE SEMICONDUCTOR PACKAGE HAVING IMPROVED CHIP EDGE SUPPORT TO PREVENT CHIP CRACKING
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Assignee
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NO. 26, CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
KAOSHIUNG, TAIWAN R.O.C |
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Correspondence name and address
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LOWE HAUPTMAN GOPSTEIN GILMAN & BERNER
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BENJAMIN J. HAUPTMAN
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1700 DIAGONAL ROAD, SUITE 310
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ALEXANDRIA, VA 22314
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