Patent Assignment Details
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Reel/Frame: | 011652/0034 | |
| Pages: | 4 |
| | Recorded: | 03/28/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/22/2003
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Application #:
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09745241
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Filing Dt:
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12/21/2000
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Publication #:
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Pub Dt:
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05/10/2001
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Title:
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INTEGRATED CIRCUIT BONDING PADS INCLUDING CONDUCTIVE LAYERS WITH ARRAYS OF UNALIGNED SPACED APART INSULATING ISLANDS THEREIN AND METHODS OF FORMING SAME
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Assignee
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416 MAETAN-DONG, PALDAL-GU |
SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MYERS BIGEL SIBLEY & SAJOVEC
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ROBERT N. CROUSE
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P.O. BOX 37428
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RALEIGH, NORTH CAROLINA 27627
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