Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 031867/0034 | |
| Pages: | 3 |
| | Recorded: | 12/20/2013 | | |
| Attorney Dkt #: | 100100.160025 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11467036
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Filing Dt:
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08/24/2006
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Publication #:
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Pub Dt:
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02/28/2008
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Title:
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FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS
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Patent #:
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Issue Dt:
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01/28/2014
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Application #:
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12437027
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Filing Dt:
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05/07/2009
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Publication #:
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Pub Dt:
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09/03/2009
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Title:
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FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS
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Assignee
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| 1 COMMERCE VALLEY DRIVE EAST |
| MARKHAM, ONTARIO, CANADA L3T 7X6 |
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Correspondence name and address
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CHRISTOPHER J. RECKAMP
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311 S. WACKER DRIVE
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FAEGRE BAKER DANIELS LLP
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CHICAGO, IL 60606
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