Patent Assignment Details
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Reel/Frame: | 013562/0035 | |
| Pages: | 2 |
| | Recorded: | 12/05/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/30/2004
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Application #:
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10314064
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Filing Dt:
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12/05/2002
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Title:
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STACKED MULTI-CHIP SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
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Assignee
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NO. 2 LI-HSIN ROAD |
3, SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN R.O.C. |
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Correspondence name and address
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ANDERSON KILL & OLICK, P.C.
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EUGENE LIEBERSTEIN
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1251 AVENUE OF THE AMERICAS
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42ND FLOOR
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NEW YORK, NY 10020
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