Patent Assignment Details
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| Reel/Frame: | 049493/0036 | |
| Pages: | 3 |
| | Recorded: | 06/17/2019 | | |
| Attorney Dkt #: | 102351-1363 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/10/2021
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Application #:
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16443574
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Filing Dt:
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06/17/2019
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Publication #:
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Pub Dt:
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12/17/2020
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
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Assignee
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| 26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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Correspondence name and address
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FOLEY & LARDNER LLP
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3000 K STREET, N.W.
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SUITE 600
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WASHINGTON, DC 20007
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