Patent Assignment Details
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| Reel/Frame: | 060723/0036 | |
| Pages: | 6 |
| | Recorded: | 08/04/2022 | | |
| Attorney Dkt #: | 49606.766US02 (194710D1) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/05/2024
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Application #:
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17843986
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Filing Dt:
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06/18/2022
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Publication #:
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Pub Dt:
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10/06/2022
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Title:
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HIGH-DENSITY FLIP CHIP PACKAGE FOR WIRELESS TRANSCEIVERS
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Assignee
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121-1714 |
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Correspondence name and address
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HAYNES AND BOONE, LLP
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2323 VICTORY AVENUE
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SUITE 700
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DALLAS, TX 75219
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06/03/2024 07:54 AM
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