Patent Assignment Details
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Reel/Frame: | 042951/0037 | |
| Pages: | 4 |
| | Recorded: | 06/22/2017 | | |
Attorney Dkt #: | MEMSC-012XX |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE STATE OF INCORPORATION INSIDE THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 016423 FRAME: 0944. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/28/2007
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Application #:
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11088633
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Filing Dt:
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03/24/2005
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Publication #:
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Pub Dt:
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09/28/2006
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Title:
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WAFER-LEVEL PACKAGE FOR INTEGRATED CIRCUITS
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Assignee
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ONE TECHNOLOGY DRIVE |
SUITE 325 |
ANDOVER, MASSACHUSETTS 01810 |
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Correspondence name and address
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PRETI FLAHERTY BELIVEAU & PACHIOS
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60 STATE STREET
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BOSTON, MA 02109
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