Patent Assignment Details
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| Reel/Frame: | 020295/0039 | |
| Pages: | 3 |
| | Recorded: | 12/27/2007 | | |
| Attorney Dkt #: | CU-6308 WWP/NK |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/27/2010
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Application #:
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11965087
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Filing Dt:
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12/27/2007
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Publication #:
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Pub Dt:
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06/04/2009
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Title:
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WAFER LEVEL SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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| SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI |
| KYOUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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RICHARD J. STREIT
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LADAS & PARRY, 224 SOUTH MICHIGAN AVE.
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CHICAGO, IL 60604
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