Patent Assignment Details
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Reel/Frame: | 037168/0039 | |
| Pages: | 6 |
| | Recorded: | 11/30/2015 | | |
Attorney Dkt #: | 48301-297001US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14954093
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Filing Dt:
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11/30/2015
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Publication #:
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Pub Dt:
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03/02/2017
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Title:
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POWER SEMICONDUCTOR MODULE THAT DIRECTLY BONDS AN ELECTRONIC DEVICE AND A LEAD AND METHOD FOR MANUFACTURING THE SAME
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Assignees
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12, HEOLLEUNG-RO, SEOCHO-GU |
SEOUL, KOREA, REPUBLIC OF 06797 |
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12, HEOLLEUNG-RO, SEOCHO-GU |
SEOUL, KOREA, REPUBLIC OF 137-938 |
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AM CAMPEON 1-12, |
NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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MINTZ LEVIN
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ONE FINANCIAL CENTER
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BOSTON, MA 02111
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