Patent Assignment Details
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| Reel/Frame: | 056124/0039 | |
| Pages: | 5 |
| | Recorded: | 05/04/2021 | | |
| Attorney Dkt #: | P/4076-477 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/13/2023
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Application #:
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17307028
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Filing Dt:
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05/04/2021
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Publication #:
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Pub Dt:
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11/10/2022
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Title:
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FLEXIBLE SINTER TOOL FOR BONDING SEMICONDUCTOR DEVICES
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Assignee
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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Correspondence name and address
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OSTROLENK FABER LLP
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845 THIRD AVENUE
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8TH FLOOR
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NEW YORK, NY 10022
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05/27/2024 10:41 AM
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