Patent Assignment Details
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Reel/Frame: | 022816/0040 | |
| Pages: | 5 |
| | Recorded: | 06/11/2009 | | |
Attorney Dkt #: | BDG047 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/12/2010
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Application #:
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12363765
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Filing Dt:
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02/01/2009
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Title:
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METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH METAL PILLAR AND ENCAPSULANT GRINDING AND HEAT SINK ATTACHMENT
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Assignee
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3RD FLOOR, 157 LI-TE ROAD, PEITOU DISTRICT |
TAIPEI, TAIWAN 112 |
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Correspondence name and address
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DAVID M. SIGMOND
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10 ANSON ROAD #47-14
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SINGAPORE, 079903 SINGAPORE
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