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Reel/Frame:024742/0040   Pages: 4
Recorded: 07/26/2010
Attorney Dkt #:TSM10-0267
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/11/2014
Application #:
12843549
Filing Dt:
07/26/2010
Publication #:
Pub Dt:
01/26/2012
Title:
Package-on-Package Structures with Reduced Bump Bridging
Assignors
1
Exec Dt:
06/28/2010
2
Exec Dt:
06/28/2010
3
Exec Dt:
06/28/2010
4
Exec Dt:
06/28/2010
5
Exec Dt:
07/22/2010
6
Exec Dt:
06/28/2010
Assignee
1
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77 R.O.C.
Correspondence name and address
SLATER & MATSIL, L.L.P.
17950 PRESTON ROAD
SUITE 1000
DALLAS, TX 75252

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