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Reel/Frame:046990/0040   Pages: 6
Recorded: 09/27/2018
Attorney Dkt #:073618-1085503
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/11/2019
Application #:
15773772
Filing Dt:
05/04/2018
Publication #:
Pub Dt:
11/08/2018
Title:
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACTURING METHODS THEREFOR
Assignors
1
Exec Dt:
05/03/2018
2
Exec Dt:
05/03/2018
3
Exec Dt:
05/03/2018
4
Exec Dt:
05/03/2018
5
Exec Dt:
05/03/2018
Assignee
1
ROOM#8078, 8F, HI-TECH BUILDING, NO. 2, JIAYUAN ROAD, EAST LAKE HI-TECH DEVELOPMENT ZONE
WUHAN, CHINA 430074
Correspondence name and address
KILPATRICK TOWNSEND & STOCKTON LLP
1100 PEACHTREE STREET, SUITE 2800
MAILSTOP: IP DOCKETING - 22
ATLANTA, GA 30309

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