Patent Assignment Details
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| Reel/Frame: | 055657/0041 | |
| Pages: | 4 |
| | Recorded: | 03/19/2021 | | |
| Attorney Dkt #: | 066160-556667 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/05/2022
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Application #:
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17207368
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Filing Dt:
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03/19/2021
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Publication #:
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Pub Dt:
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03/10/2022
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Title:
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FAN-OUT WAFER-LEVEL PACKAGING STRUCTURE AND METHOD PACKAGING THE SAME
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Assignee
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| 78 CHANGSHAN AVENUE |
| JIANGYIN CITY, JIANGSU PROVINCE, CHINA 214437 |
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Correspondence name and address
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ALSTON & BIRD LLP
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BANK OF AMERICA PLAZA
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101 SOUTH TRYON STREET, SUITE 4000
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CHARLOTTE, NC 28280-4000
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