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Reel/Frame:031843/0043   Pages: 5
Recorded: 12/23/2013
Attorney Dkt #:PA1439-0
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/12/2016
Application #:
14139249
Filing Dt:
12/23/2013
Publication #:
Pub Dt:
01/08/2015
Title:
SEMICONDUCTOR CHIP AND STACKED TYPE SEMICONDUCTOR PACKAGE HAVING THE SAME
Assignors
1
Exec Dt:
12/06/2013
2
Exec Dt:
12/06/2013
3
Exec Dt:
12/06/2013
4
Exec Dt:
11/13/2013
5
Exec Dt:
11/13/2013
Assignees
1
2091, GYEONGCHUNG-DAERO, BUBAL-EUB
ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
2
1, GWANAK-RO, GWANAK-GU
SEOUL, KOREA, REPUBLIC OF
Correspondence name and address
WILLIAM PARK & ASSOCIATES PATENT LTD.
930 N. YORK ROAD, SUITE 201
HINSDALE, IL 60521

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