Patent Assignment Details
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| Reel/Frame: | 013606/0044 | |
| Pages: | 4 |
| | Recorded: | 12/19/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/23/2004
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Application #:
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10232678
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Filing Dt:
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09/03/2002
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Title:
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PREMOLDED CAVITY IC PACKAGE
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Assignee
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| QPL INDUSTRIAL BUILDING, 14TH FLOOR, 138 TEXACO RD |
| TSUEN WAN, NEW TERRITORIES, HONG KONG |
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Correspondence name and address
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JOSEPH R. KEATING, ESQ.
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KEATING & BENNETT LLP
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10400 EATON PLACE, SUITE 312
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FAIRFAX, VA 22030
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