Patent Assignment Details
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| Reel/Frame: | 058210/0045 | |
| Pages: | 5 |
| | Recorded: | 11/24/2021 | | |
| Attorney Dkt #: | 113483-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/02/2024
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Application #:
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17529293
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Filing Dt:
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11/18/2021
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Publication #:
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Pub Dt:
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04/20/2023
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Title:
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INTERPOSER AND SEMICONDUCTOR PACKAGE EACH HAVING CONDUCTIVE TERMINALS ON REDISTRIBUTION LAYER WITH DIFFERENT PITCH
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Assignees
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| NO.10, LIXING 6TH RD., SCIENCE-BASED INDUSTRIAL PARK, |
| HSINCHU, TAIWAN 30078 |
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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JCIPRNET
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8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
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TAIPEI, 100404 TAIWAN
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