Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 065834/0045 | |
| Pages: | 6 |
| | Recorded: | 12/11/2023 | | |
| Attorney Dkt #: | 04435/011556-US1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18536120
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Filing Dt:
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12/11/2023
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Publication #:
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Pub Dt:
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06/13/2024
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Title:
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Hybrid Printing of Copper Conductive Material
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Assignees
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| 15/F, K.K. LEUNG BUILDING, THE UNIVERSITY OF HONG KONG, POKFULAM |
| HONG KONG, CHINA |
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| UNIT 1102, 11/F, BUILDING 17W, 17 SCIENCE PARK WEST AVENUE |
| HONG KONG, CHINA |
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Correspondence name and address
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LEASON ELLIS LLP
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ONE BARKER AVENUE
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FIFTH FLOOR
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WHITE PLAINS, NY 10601
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09/20/2024 02:48 PM
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