Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 015647/0046 | |
| Pages: | 3 |
| | Recorded: | 02/02/2005 | | |
Conveyance: | CORRECTION OF REEL 015502 FRAME 0784 CORRECTING RECEIVING PARTIES ADDRESS. |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
01/19/2010
|
Application #:
|
10486078
|
Filing Dt:
|
02/06/2004
|
Publication #:
|
|
Pub Dt:
|
10/14/2004
| | | | |
Title:
|
COPPER ELECTROPLATING METHOD, PURE COPPER ANODE FOR COPPER ELECTROPLATING, AND SEMICONDUCTOR WAFER PLATED THEREBY WITH LITTLE PARTICLE ADHESION
|
|
Assignee
|
|
|
10-1, TORANOMON 2-CHOME |
MINATO-KU TOKYO, JAPAN 105-8407 |
|
Correspondence name and address
|
|
HOWSON AND HOWSON
|
|
WILLIAM BAK, ESQUIRE
|
|
SPRING HOUSE CORPORATE CENTER
|
|
BOX 457
|
|
SPRING HOUSE, PA 19477
|
Search Results as of:
06/03/2024 04:49 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|