Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 023196/0046 | |
| Pages: | 3 |
| | Recorded: | 09/04/2009 | | |
Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
6
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Patent #:
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Issue Dt:
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05/18/2004
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Application #:
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10176571
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Filing Dt:
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06/21/2002
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Publication #:
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Pub Dt:
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12/26/2002
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Title:
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METHOD AND APPARATUS FOR WAFER SCALE TESTING
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Patent #:
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Issue Dt:
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01/31/2006
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Application #:
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10370393
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Filing Dt:
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02/19/2003
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Publication #:
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Pub Dt:
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08/19/2004
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Title:
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METHODS AND APPARATUS FOR ADDITION OF ELECTRICAL CONDUCTORS TO PREVIOUSLY FABRICATED DEVICE
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Patent #:
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Issue Dt:
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12/28/2004
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Application #:
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10633011
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Filing Dt:
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08/01/2003
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Publication #:
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Pub Dt:
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02/12/2004
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Title:
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METHOD AND APPARATUS FOR WAFER SCALE TESTING
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Patent #:
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Issue Dt:
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10/16/2007
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Application #:
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10789305
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Filing Dt:
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02/27/2004
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Publication #:
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Pub Dt:
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08/26/2004
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Title:
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FULL WAFER CONTACTER AND APPLICATIONS THEREOF
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11729039
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Filing Dt:
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03/27/2007
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Publication #:
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Pub Dt:
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10/04/2007
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Title:
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Desktop wafer analysis station
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11811880
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Filing Dt:
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06/11/2007
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Publication #:
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Pub Dt:
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01/03/2008
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Title:
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Laser isolation of metal over alumina underlayer and structures formed thereby
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Assignee
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20520 NW EVERGREEN PARKWAY |
SUITE 100 |
HILLSBORO, OREGON 97124 |
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Correspondence name and address
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RAYMOND J. WERNER
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2056 NW ALOCLEK DRIVE
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SUITE 314
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HILLSBORO, OREGON 97124
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