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Reel/Frame:044209/0047   Pages: 69
Recorded: 09/21/2017
Attorney Dkt #:FSL NXP CORRECTIVE ASSGN
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040632 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME.
Total properties: 1087
Page 10 of 11
Pages: 1 2 3 4 5 6 7 8 9 10 11
1
Patent #:
9214402
Issue Dt:
12/15/2015
Application #:
14151811
Filing Dt:
01/10/2014
Publication #:
US20150200180
Pub Dt:
07/16/2015
Title:
PRESSURE SENSOR DEVICE WITH GEL RETAINER
2
Patent #:
9474162
Issue Dt:
10/18/2016
Application #:
14151828
Filing Dt:
01/10/2014
Publication #:
US20150201489
Pub Dt:
07/16/2015
Title:
CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING SAME
3
Patent #:
8722465
Issue Dt:
05/13/2014
Application #:
14155309
Filing Dt:
01/14/2014
Publication #:
US20140127862
Pub Dt:
05/08/2014
Title:
METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBSTRATE AND HEAT SINK
4
Patent #:
9305898
Issue Dt:
04/05/2016
Application #:
14161706
Filing Dt:
01/23/2014
Publication #:
US20150206834
Pub Dt:
07/23/2015
Title:
SEMICONDUCTOR DEVICE WITH COMBINED POWER AND GROUND RING STRUCTURE
5
Patent #:
9117534
Issue Dt:
08/25/2015
Application #:
14161927
Filing Dt:
01/23/2014
Publication #:
US20150206594
Pub Dt:
07/23/2015
Title:
FUSE CIRCUIT WITH TEST MODE
6
Patent #:
8853867
Issue Dt:
10/07/2014
Application #:
14170067
Filing Dt:
01/31/2014
Publication #:
US20140145339
Pub Dt:
05/29/2014
Title:
ENCAPSULANT FOR A SEMICONDUCTOR DEVICE
7
Patent #:
9214928
Issue Dt:
12/15/2015
Application #:
14170070
Filing Dt:
01/31/2014
Publication #:
US20150222253
Pub Dt:
08/06/2015
Title:
CLOCK DOUBLING CIRCUIT AND METHOD OF OPERATION
8
Patent #:
9190339
Issue Dt:
11/17/2015
Application #:
14170653
Filing Dt:
02/03/2014
Publication #:
US20150221572
Pub Dt:
08/06/2015
Title:
METHOD OF LIMITING CAPILLARY ACTION OF GEL MATERIAL DURING ASSEMBLY OF PRESSURE SENSOR
9
Patent #:
9346671
Issue Dt:
05/24/2016
Application #:
14172479
Filing Dt:
02/04/2014
Publication #:
US20150217998
Pub Dt:
08/06/2015
Title:
SHIELDING MEMS STRUCTURES DURING WAFER DICING
10
Patent #:
9024427
Issue Dt:
05/05/2015
Application #:
14178244
Filing Dt:
02/11/2014
Publication #:
US20140284805
Pub Dt:
09/25/2014
Title:
MULTIPLE HELIX SUBSTRATE AND THREE-DIMENSIONAL PACKAGE WITH SAME
11
Patent #:
9099363
Issue Dt:
08/04/2015
Application #:
14178294
Filing Dt:
02/12/2014
Publication #:
US20150228601
Pub Dt:
08/13/2015
Title:
SUBSTRATE WITH CORNER CUT-OUTS AND SEMICONDUCTOR DEVICE ASSEMBLED THEREWITH
12
Patent #:
9136845
Issue Dt:
09/15/2015
Application #:
14180322
Filing Dt:
02/13/2014
Publication #:
US20150229307
Pub Dt:
08/13/2015
Title:
Level Shifter With Improved Operation
13
Patent #:
9458012
Issue Dt:
10/04/2016
Application #:
14182736
Filing Dt:
02/18/2014
Publication #:
US20150232332
Pub Dt:
08/20/2015
Title:
METHOD FOR SHIELDING MEMS STRUCTURES DURING FRONT SIDE WAFER DICING
14
Patent #:
9177834
Issue Dt:
11/03/2015
Application #:
14184672
Filing Dt:
02/19/2014
Publication #:
US20150235924
Pub Dt:
08/20/2015
Title:
POWER BAR DESIGN FOR LEAD FRAME-BASED PACKAGES
15
Patent #:
9379700
Issue Dt:
06/28/2016
Application #:
14187450
Filing Dt:
02/24/2014
Publication #:
US20150244359
Pub Dt:
08/27/2015
Title:
Dual-Voltage Detector Having Disable Outputs Within Separate Voltage Domain and Related Methods
16
Patent #:
9123545
Issue Dt:
09/01/2015
Application #:
14188461
Filing Dt:
02/24/2014
Publication #:
US20140167102
Pub Dt:
06/19/2014
Title:
SEMICONDUCTOR DEVICE WITH SINGLE-EVENT LATCH-UP PREVENTION CIRCUITRY
17
Patent #:
9490031
Issue Dt:
11/08/2016
Application #:
14190595
Filing Dt:
02/26/2014
Publication #:
US20150243368
Pub Dt:
08/27/2015
Title:
HIGH-SPEED ADDRESS FAULT DETECTION USING SPLIT ADDRESS ROM
18
Patent #:
9034694
Issue Dt:
05/19/2015
Application #:
14191448
Filing Dt:
02/27/2014
Title:
EMBEDDED DIE BALL GRID ARRAY PACKAGE
19
Patent #:
9106485
Issue Dt:
08/11/2015
Application #:
14193189
Filing Dt:
02/28/2014
Publication #:
US20150249560
Pub Dt:
09/03/2015
Title:
SYSTEM AND METHOD FOR FSK DEMODULATION
20
Patent #:
9142507
Issue Dt:
09/22/2015
Application #:
14193866
Filing Dt:
02/28/2014
Publication #:
US20150249048
Pub Dt:
09/03/2015
Title:
STRESS MIGRATION MITIGATION UTILIZING INDUCED STRESS EFFECTS IN METAL TRACE OF INTEGRATED CIRCUIT DEVICE
21
Patent #:
9257839
Issue Dt:
02/09/2016
Application #:
14193921
Filing Dt:
02/28/2014
Publication #:
US20150249335
Pub Dt:
09/03/2015
Title:
SYSTEMS AND METHODS FOR MANAGING MULTIPLE POWER DOMAINS
22
Patent #:
9231077
Issue Dt:
01/05/2016
Application #:
14195299
Filing Dt:
03/03/2014
Publication #:
US20150249140
Pub Dt:
09/03/2015
Title:
METHOD OF MAKING A LOGIC TRANSISTOR AND NON-VOLATILE MEMORY (NVM) CELL
23
Patent #:
9312206
Issue Dt:
04/12/2016
Application #:
14196557
Filing Dt:
03/04/2014
Publication #:
US20150255371
Pub Dt:
09/10/2015
Title:
SEMICONDUCTOR PACKAGE WITH THERMAL VIA AND METHOD FOR FABRICATION THEREOF
24
Patent #:
9108841
Issue Dt:
08/18/2015
Application #:
14197962
Filing Dt:
03/05/2014
Publication #:
US20150251903
Pub Dt:
09/10/2015
Title:
MICROELECTRONIC PACKAGES HAVING STACKED ACCELEROMETER AND MAGNETOMETER DIE AND METHODS FOR THE PRODUCTION THEREOF
25
Patent #:
8946862
Issue Dt:
02/03/2015
Application #:
14199980
Filing Dt:
03/06/2014
Publication #:
US20140187014
Pub Dt:
07/03/2014
Title:
METHODS FOR FORMING BIPOLAR TRANSISTORS
26
Patent #:
9209120
Issue Dt:
12/08/2015
Application #:
14205323
Filing Dt:
03/11/2014
Publication #:
US20150262924
Pub Dt:
09/17/2015
Title:
SEMICONDUCTOR PACKAGE WITH LEAD MOUNTED POWER BAR
27
Patent #:
9331029
Issue Dt:
05/03/2016
Application #:
14210057
Filing Dt:
03/13/2014
Publication #:
US20150262931
Pub Dt:
09/17/2015
Title:
MICROELECTRONIC PACKAGES HAVING MOLD-EMBEDDED TRACES AND METHODS FOR THE PRODUCTION THEREOF
28
Patent #:
8969139
Issue Dt:
03/03/2015
Application #:
14215680
Filing Dt:
03/17/2014
Publication #:
US20140220738
Pub Dt:
08/07/2014
Title:
LEAD FRAME ARRAY PACKAGE WITH FLIP CHIP DIE ATTACH
29
Patent #:
9257419
Issue Dt:
02/09/2016
Application #:
14216690
Filing Dt:
03/17/2014
Publication #:
US20150262981
Pub Dt:
09/17/2015
Title:
LEADFRAME-BASED SYSTEM-IN-PACKAGES HAVING SIDEWALL-MOUNTED SURFACE MOUNT DEVICES AND METHODS FOR THE PRODUCTION THEREOF
30
Patent #:
8802474
Issue Dt:
08/12/2014
Application #:
14219011
Filing Dt:
03/19/2014
Publication #:
US20140206124
Pub Dt:
07/24/2014
Title:
PRESSURE SENSOR AND METHOD OF PACKAGING SAME
31
Patent #:
9224651
Issue Dt:
12/29/2015
Application #:
14219094
Filing Dt:
03/19/2014
Publication #:
US20140287554
Pub Dt:
09/25/2014
Title:
METHOD FOR PLATING A SEMICONDUCTOR PACKAGE LEAD
32
Patent #:
9293395
Issue Dt:
03/22/2016
Application #:
14220118
Filing Dt:
03/19/2014
Publication #:
US20150270195
Pub Dt:
09/24/2015
Title:
LEAD FRAME WITH MOLD LOCK STRUCTURE
33
Patent #:
9297713
Issue Dt:
03/29/2016
Application #:
14220121
Filing Dt:
03/19/2014
Publication #:
US20150270206
Pub Dt:
09/24/2015
Title:
PRESSURE SENSOR DEVICE WITH THROUGH SILICON VIA
34
Patent #:
9502363
Issue Dt:
11/22/2016
Application #:
14223805
Filing Dt:
03/24/2014
Publication #:
US20150270233
Pub Dt:
09/24/2015
Title:
WAFER LEVEL PACKAGES AND METHODS FOR PRODUCING WAFER LEVEL PACKAGES HAVING DELAMINATION-RESISTANT REDISTRIBUTION LAYERS
35
Patent #:
9177096
Issue Dt:
11/03/2015
Application #:
14226555
Filing Dt:
03/26/2014
Publication #:
US20150278425
Pub Dt:
10/01/2015
Title:
TIMING CLOSURE USING TRANSISTOR SIZING IN STANDARD CELLS
36
Patent #:
9112056
Issue Dt:
08/18/2015
Application #:
14228682
Filing Dt:
03/28/2014
Title:
METHOD FOR FORMING A SPLIT-GATE DEVICE
37
Patent #:
9294081
Issue Dt:
03/22/2016
Application #:
14229270
Filing Dt:
03/28/2014
Publication #:
US20150280701
Pub Dt:
10/01/2015
Title:
SYSTEM AND METHOD FOR BREAKDOWN PROTECTION FOR SWITCHING OUTPUT DRIVER
38
Patent #:
9499397
Issue Dt:
11/22/2016
Application #:
14230273
Filing Dt:
03/31/2014
Publication #:
US20150274515
Pub Dt:
10/01/2015
Title:
MICROELECTRONIC PACKAGES HAVING AXIALLY-PARTITIONED HERMETIC CAVITIES AND METHODS FOR THE FABRICATION THEREOF
39
Patent #:
9343422
Issue Dt:
05/17/2016
Application #:
14230274
Filing Dt:
03/31/2014
Publication #:
US20150279809
Pub Dt:
10/01/2015
Title:
STRUCTURE FOR ALUMINUM PAD METAL UNDER BALL BOND
40
Patent #:
9312768
Issue Dt:
04/12/2016
Application #:
14230710
Filing Dt:
03/31/2014
Publication #:
US20150280561
Pub Dt:
10/01/2015
Title:
COMPARATOR FOR SYNCHRONOUS RECTIFICATION AND METHOD OF OPERATION
41
Patent #:
9225247
Issue Dt:
12/29/2015
Application #:
14230734
Filing Dt:
03/31/2014
Publication #:
US20150280562
Pub Dt:
10/01/2015
Title:
COMPARATOR FOR SYNCHRONOUS RECTIFICATION AND METHOD OF OPERATION
42
Patent #:
9209078
Issue Dt:
12/08/2015
Application #:
14230875
Filing Dt:
03/31/2014
Publication #:
US20140213050
Pub Dt:
07/31/2014
Title:
METHOD OF MAKING A DIE WITH RECESSED ALUMINUM DIE PADS
43
Patent #:
9202808
Issue Dt:
12/01/2015
Application #:
14231849
Filing Dt:
04/01/2014
Publication #:
US20150279836
Pub Dt:
10/01/2015
Title:
INTEGRATED CIRCUIT ELECTRICAL PROTECTION DEVICE
44
Patent #:
9165102
Issue Dt:
10/20/2015
Application #:
14246544
Filing Dt:
04/07/2014
Publication #:
US20150286768
Pub Dt:
10/08/2015
Title:
Routing Standard Cell-Based Integrated Circuits
45
Patent #:
9137083
Issue Dt:
09/15/2015
Application #:
14255265
Filing Dt:
04/17/2014
Title:
SYNCHRONIZATION AND FREQUENCY CORRECTION FOR A RECEIVER
46
Patent #:
9190355
Issue Dt:
11/17/2015
Application #:
14255957
Filing Dt:
04/18/2014
Publication #:
US20150303137
Pub Dt:
10/22/2015
Title:
MULTI-USE SUBSTRATE FOR INTEGRATED CIRCUIT
47
Patent #:
9365414
Issue Dt:
06/14/2016
Application #:
14257553
Filing Dt:
04/21/2014
Publication #:
US20150298966
Pub Dt:
10/22/2015
Title:
SENSOR PACKAGE HAVING STACKED DIE
48
Patent #:
9476788
Issue Dt:
10/25/2016
Application #:
14258024
Filing Dt:
04/22/2014
Publication #:
US20150300905
Pub Dt:
10/22/2015
Title:
SEMICONDUCTOR SENSOR WITH GEL FILLED CAVITY
49
Patent #:
9324675
Issue Dt:
04/26/2016
Application #:
14262381
Filing Dt:
04/25/2014
Publication #:
US20150311173
Pub Dt:
10/29/2015
Title:
STRUCTURES FOR REDUCING CORROSION IN WIRE BONDS
50
Patent #:
9111755
Issue Dt:
08/18/2015
Application #:
14262417
Filing Dt:
04/25/2014
Title:
BOND PAD AND PASSIVATION LAYER HAVING A GAP AND METHOD FOR FORMING
51
Patent #:
9412467
Issue Dt:
08/09/2016
Application #:
14264473
Filing Dt:
04/29/2014
Publication #:
US20150310932
Pub Dt:
10/29/2015
Title:
SEMICONDUCTOR DEVICE HAVING A TEST CONTROLLER AND METHOD OF OPERATION
52
Patent #:
9501442
Issue Dt:
11/22/2016
Application #:
14265847
Filing Dt:
04/30/2014
Publication #:
US20150317266
Pub Dt:
11/05/2015
Title:
CONFIGURABLE PERIPHERAL COMPONENENT INTERCONNECT EXPRESS (PCIe) CONTROLLER
53
Patent #:
9197231
Issue Dt:
11/24/2015
Application #:
14266193
Filing Dt:
04/30/2014
Publication #:
US20150318862
Pub Dt:
11/05/2015
Title:
SYSTEMS AND METHODS FOR DATA CONVERSION
54
Patent #:
9437459
Issue Dt:
09/06/2016
Application #:
14267378
Filing Dt:
05/01/2014
Publication #:
US20150318240
Pub Dt:
11/05/2015
Title:
ALUMINUM CLAD COPPER STRUCTURE OF AN ELECTRONIC COMPONENT PACKAGE AND A METHOD OF MAKING AN ELECTRONIC COMPONENT PACKAGE WITH AN ALUMINUM CLAD COPPER STRUCTURE
55
Patent #:
9093383
Issue Dt:
07/28/2015
Application #:
14268420
Filing Dt:
05/02/2014
Title:
ENCAPSULANT FOR A SEMICONDUCTOR DEVICE
56
Patent #:
9064718
Issue Dt:
06/23/2015
Application #:
14271469
Filing Dt:
05/07/2014
Title:
PRE-FORMED VIA ARRAY FOR INTEGRATED CIRCUIT PACKAGE
57
Patent #:
9214447
Issue Dt:
12/15/2015
Application #:
14277061
Filing Dt:
05/14/2014
Publication #:
US20150028468
Pub Dt:
01/29/2015
Title:
NON-LEADED TYPE SEMICONDUCTOR PACKAGE AND METHOD OF ASSEMBLING SAME
58
Patent #:
9401339
Issue Dt:
07/26/2016
Application #:
14277343
Filing Dt:
05/14/2014
Publication #:
US20150333028
Pub Dt:
11/19/2015
Title:
WAFER LEVEL PACAKGES HAVING NON-WETTABLE SOLDER COLLARS AND METHODS FOR THE FABRICATION THEREOF
59
Patent #:
9196576
Issue Dt:
11/24/2015
Application #:
14277801
Filing Dt:
05/15/2014
Publication #:
US20150084169
Pub Dt:
03/26/2015
Title:
SEMICONDUCTOR PACKAGE WITH STRESS RELIEF AND HEAT SPREADER
60
Patent #:
9218440
Issue Dt:
12/22/2015
Application #:
14280056
Filing Dt:
05/16/2014
Publication #:
US20150331981
Pub Dt:
11/19/2015
Title:
TIMING VERIFICATION OF AN INTEGRATED CIRCUIT
61
Patent #:
9122812
Issue Dt:
09/01/2015
Application #:
14284950
Filing Dt:
05/22/2014
Publication #:
US20140258582
Pub Dt:
09/11/2014
Title:
SEMICONDUCTOR DEVICE WITH VIAS ON A BRIDGE CONNECTING TWO BUSES
62
Patent #:
9105599
Issue Dt:
08/11/2015
Application #:
14287141
Filing Dt:
05/26/2014
Publication #:
US20140252586
Pub Dt:
09/11/2014
Title:
SEMICONDUCTOR DEVICES THAT INCLUDE A DIE BONDED TO A SUBSTRATE WITH A GOLD INTERFACE LAYER
63
Patent #:
9111901
Issue Dt:
08/18/2015
Application #:
14287142
Filing Dt:
05/26/2014
Publication #:
US20140256091
Pub Dt:
09/11/2014
Title:
METHODS FOR BONDING A DIE AND A SUBSTRATE
64
Patent #:
9325549
Issue Dt:
04/26/2016
Application #:
14287574
Filing Dt:
05/27/2014
Publication #:
US20150280647
Pub Dt:
10/01/2015
Title:
CONVERTER UNIT FOR AN M-ORDER DIGITAL MODULATION AND A METHOD THEREOF
65
Patent #:
9219107
Issue Dt:
12/22/2015
Application #:
14288268
Filing Dt:
05/27/2014
Publication #:
US20140273391
Pub Dt:
09/18/2014
Title:
INDUCTIVE ELEMENT WITH INTERRUPTER REGION AND METHOD FOR FORMING
66
Patent #:
9100115
Issue Dt:
08/04/2015
Application #:
14288525
Filing Dt:
05/28/2014
Title:
PROCESSOR UNIT FOR DETERMINING A QUALITY INDICATOR OF A COMMUNICATION CHANNEL AND A METHOD THEREOF
67
Patent #:
9235673
Issue Dt:
01/12/2016
Application #:
14288531
Filing Dt:
05/28/2014
Publication #:
US20150347655
Pub Dt:
12/03/2015
Title:
APPARATUS FOR AND A METHOD OF MAKING A HIERARCHICAL INTEGRATED CIRCUIT DESIGN OF AN INTEGRATED CIRCUIT DESIGN, A COMPUTER PROGRAM PRODUCT AND A NON-TRANSITORY TANGIBLE COMPUTER READABLE STORAGE MEDIUM
68
Patent #:
9355985
Issue Dt:
05/31/2016
Application #:
14291547
Filing Dt:
05/30/2014
Publication #:
US20150348865
Pub Dt:
12/03/2015
Title:
MICROELECTRONIC PACKAGES HAVING SIDEWALL-DEPOSITED HEAT SPREADER STRUCTURES AND METHODS FOR THE FABRICATION THEREOF
69
Patent #:
9455220
Issue Dt:
09/27/2016
Application #:
14292886
Filing Dt:
05/31/2014
Publication #:
US20150348898
Pub Dt:
12/03/2015
Title:
APPARATUS AND METHOD FOR PLACING STRESSORS ON INTERCONNECTS WITHIN AN INTEGRATED CIRCUIT DEVICE TO MANAGE ELECTROMIGRATION FAILURES
70
Patent #:
8945989
Issue Dt:
02/03/2015
Application #:
14292938
Filing Dt:
06/01/2014
Publication #:
US20140302641
Pub Dt:
10/09/2014
Title:
STIFFENED SEMICONDUCTOR DIE PACKAGE
71
Patent #:
9213761
Issue Dt:
12/15/2015
Application #:
14294218
Filing Dt:
06/03/2014
Publication #:
US20150347424
Pub Dt:
12/03/2015
Title:
ELECTRONIC SYSTEMS AND METHODS FOR INTEGRATED, AUTOMATIC, MEDIUM-QUALITY AUDIO
72
Patent #:
9472528
Issue Dt:
10/18/2016
Application #:
14296835
Filing Dt:
06/05/2014
Publication #:
US20150357270
Pub Dt:
12/10/2015
Title:
INTEGRATED ELECTRONIC PACKAGE AND METHOD OF FABRICATION
73
Patent #:
9165904
Issue Dt:
10/20/2015
Application #:
14306254
Filing Dt:
06/17/2014
Title:
INSULATED WIRE BONDING WITH EFO BEFORE SECOND BOND
74
Patent #:
9479288
Issue Dt:
10/25/2016
Application #:
14306692
Filing Dt:
06/17/2014
Publication #:
US20150365224
Pub Dt:
12/17/2015
Title:
TECHIQUES FOR TIME-DOMAIN FRAME SYNCHRONIZATION OF PACKETS
75
Patent #:
9281284
Issue Dt:
03/08/2016
Application #:
14310992
Filing Dt:
06/20/2014
Publication #:
US20150371960
Pub Dt:
12/24/2015
Title:
SYSTEM-IN-PACKAGES HAVING VERTICALLY-INTERCONNECTED LEADED COMPONENTS AND METHODS FOR THE FABRICATION THEREOF
76
Patent #:
9287006
Issue Dt:
03/15/2016
Application #:
14313192
Filing Dt:
06/24/2014
Publication #:
US20150371720
Pub Dt:
12/24/2015
Title:
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Title:
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Assignor
1
FREESCALE SEMICONDUCTOR INC.
Exec Dt:
11/07/2016
Assignee
1
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST
AUSTIN, TEXAS 78735
Correspondence name and address
NXP USA, INC.
6501 WILLIAM CANNON DRIVE WEST
AUSTIN, TX 78735

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