USPTO Assignments on the Web

	United States Patent and Trademark Office
	Home\|Site Index\|Search\|Guides\|Contacts\|eBusiness\|eBiz alerts\|News\|Help

Assignments on the Web > Patent Query

Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	044209/0047			Pages:	69
		Recorded:	09/21/2017
Attorney Dkt #:	FSL NXP CORRECTIVE ASSGN
Conveyance:	CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040632 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME.

Total properties: 1087
Page 8 of 11
Pages: 1 2 3 4 5 6 7 8 9 10 11

Patent #:	8581390	Issue Dt:	11/12/2013	Application #:	13442015	Filing Dt:	04/09/2012
Publication #:	US20130264698	Pub Dt:	10/10/2013
Title:	SEMICONDUCTOR DEVICE WITH HEAT DISSIPATION

Patent #:	8643170	Issue Dt:	02/04/2014	Application #:	13442878	Filing Dt:	04/10/2012
Publication #:	US20120264258	Pub Dt:	10/18/2012
Title:	METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBSTRATE AND HEAT SINK

Patent #:	8552501	Issue Dt:	10/08/2013	Application #:	13447369	Filing Dt:	04/16/2012
Publication #:	US20120199879	Pub Dt:	08/09/2012
Title:	METHOD OF FORMING AN INVERTED T SHAPED CHANNEL STRUCTURE FOR AN INVERTED T CHANNEL FIELD EFFECT TRANSISTOR DEVICE

Patent #:	8546169	Issue Dt:	10/01/2013	Application #:	13455154	Filing Dt:	04/25/2012
Title:	PRESSURE SENSOR DEVICE AND METHOD OF ASSEMBLING SAME

Patent #:	9026808	Issue Dt:	05/05/2015	Application #:	13457248	Filing Dt:	04/26/2012
Publication #:	US20130290750	Pub Dt:	10/31/2013
Title:	MEMORY WITH WORD LEVEL POWER GATING

Patent #:	9484320	Issue Dt:	11/01/2016	Application #:	13458224	Filing Dt:	04/27/2012
Publication #:	US20130285220	Pub Dt:	10/31/2013
Title:	VERTICALLY PACKAGED INTEGRATED CIRCUIT

Patent #:	8643153	Issue Dt:	02/04/2014	Application #:	13461801	Filing Dt:	05/02/2012
Publication #:	US20120286406	Pub Dt:	11/15/2012
Title:	SEMICONDUCTOR DEVICE WITH STAGGERED LEADS

Patent #:	8685795	Issue Dt:	04/01/2014	Application #:	13462827	Filing Dt:	05/03/2012
Publication #:	US20120292755	Pub Dt:	11/22/2012
Title:	FLANK WETTABLE SEMICONDUCTOR DEVICE

Patent #:	9002694	Issue Dt:	04/07/2015	Application #:	13463034	Filing Dt:	05/03/2012
Publication #:	US20130297280	Pub Dt:	11/07/2013
Title:	VERIFICATION OF DESIGN DERIVED FROM POWER INTENT

Patent #:	8994190	Issue Dt:	03/31/2015	Application #:	13477764	Filing Dt:	05/22/2012
Publication #:	US20130313726	Pub Dt:	11/28/2013
Title:	LOW-TEMPERATURE FLIP CHIP DIE ATTACH

Patent #:	8906747	Issue Dt:	12/09/2014	Application #:	13478557	Filing Dt:	05/23/2012
Publication #:	US20130313700	Pub Dt:	11/28/2013
Title:	CAVITY-TYPE SEMICONDUCTOR PACKAGE AND METHOD OF PACKAGING SAME

Patent #:	9000589	Issue Dt:	04/07/2015	Application #:	13483064	Filing Dt:	05/30/2012
Publication #:	US20130320530	Pub Dt:	12/05/2013
Title:	SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS

Patent #:	8694926	Issue Dt:	04/08/2014	Application #:	13484022	Filing Dt:	05/30/2012
Publication #:	US20130326446	Pub Dt:	12/05/2013
Title:	TECHNIQUES FOR CHECKING COMPUTER-AIDED DESIGN LAYERS OF A DEVICE TO REDUCE THE OCCURRENCE OF MISSING DECK RULES

Patent #:	8955388	Issue Dt:	02/17/2015	Application #:	13484353	Filing Dt:	05/31/2012
Publication #:	US20130319129	Pub Dt:	12/05/2013
Title:	MOLD COMPOUND COMPATIBILITY TEST SYSTEM AND METHODS THEREOF

Patent #:	8674509	Issue Dt:	03/18/2014	Application #:	13485912	Filing Dt:	05/31/2012
Publication #:	US20130320548	Pub Dt:	12/05/2013
Title:	INTEGRATED CIRCUIT DIE ASSEMBLY WITH HEAT SPREADER

Patent #:	8671743	Issue Dt:	03/18/2014	Application #:	13488452	Filing Dt:	06/05/2012
Publication #:	US20130319098	Pub Dt:	12/05/2013
Title:	TEST EQUIPMENT MANIFOLD INTERFACE

Patent #:	8766402	Issue Dt:	07/01/2014	Application #:	13489139	Filing Dt:	06/05/2012
Publication #:	US20130320490	Pub Dt:	12/05/2013
Title:	INDUCTIVE ELEMENT WITH INTERRUPTER REGION

Patent #:	8652384	Issue Dt:	02/18/2014	Application #:	13489466	Filing Dt:	06/06/2012
Publication #:	US20130005087	Pub Dt:	01/03/2013
Title:	METHOD FOR MOLDING SEMICONDUCTOR DEVICE

Patent #:	8692387	Issue Dt:	04/08/2014	Application #:	13490451	Filing Dt:	06/06/2012
Publication #:	US20130020690	Pub Dt:	01/24/2013
Title:	STACKED DIE SEMICONDUCTOR PACKAGE

Patent #:	9135144	Issue Dt:	09/15/2015	Application #:	13500691	Filing Dt:	04/06/2012
Publication #:	US20120204067	Pub Dt:	08/09/2012
Title:	INTEGRATED CIRCUITS AND METHODS FOR DEBUGGING

Patent #:	9059006	Issue Dt:	06/16/2015	Application #:	13523120	Filing Dt:	06/14/2012
Publication #:	US20120249160	Pub Dt:	10/04/2012
Title:	REPLACEMENT-GATE-COMPATIBLE PROGRAMMABLE ELECTRICAL ANTIFUSE

Patent #:	8978004	Issue Dt:	03/10/2015	Application #:	13529601	Filing Dt:	06/21/2012
Publication #:	US20130212549	Pub Dt:	08/15/2013
Title:	CELL ROUTABILITY PRIORITIZATION

Patent #:	8853058	Issue Dt:	10/07/2014	Application #:	13530117	Filing Dt:	06/22/2012
Publication #:	US20130344656	Pub Dt:	12/26/2013
Title:	METHOD OF MAKING SURFACE MOUNT STACKED SEMICONDUCTOR DEVICES

Patent #:	8810020	Issue Dt:	08/19/2014	Application #:	13530118	Filing Dt:	06/22/2012
Publication #:	US20130341796	Pub Dt:	12/26/2013
Title:	SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS

Patent #:	9069762	Issue Dt:	06/30/2015	Application #:	13531317	Filing Dt:	06/22/2012
Publication #:	US20130346375	Pub Dt:	12/26/2013
Title:	Equivalence Classes Over Parameter State Space

Patent #:	8946041	Issue Dt:	02/03/2015	Application #:	13534971	Filing Dt:	06/27/2012
Publication #:	US20120264270	Pub Dt:	10/18/2012
Title:	METHODS FOR FORMING HIGH GAIN TUNABLE BIPOLAR TRANSISTORS

Patent #:	9040352	Issue Dt:	05/26/2015	Application #:	13535438	Filing Dt:	06/28/2012
Publication #:	US20140001582	Pub Dt:	01/02/2014
Title:	FILM-ASSIST MOLDED GEL-FILL CAVITY PACKAGE WITH OVERFLOW RESERVOIR

Patent #:	8661393	Issue Dt:	02/25/2014	Application #:	13536694	Filing Dt:	06/28/2012
Publication #:	US20140007029	Pub Dt:	01/02/2014
Title:	METHOD FOR ANALYZING PLACEMENT CONTEXT SENSITIVITY OF STANDARD CELLS

Patent #:	8704370	Issue Dt:	04/22/2014	Application #:	13537388	Filing Dt:	06/29/2012
Publication #:	US20140001632	Pub Dt:	01/02/2014
Title:	SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN AIR GAP AND METHOD FOR FORMING

Patent #:	8841758	Issue Dt:	09/23/2014	Application #:	13537392	Filing Dt:	06/29/2012
Publication #:	US20140001616	Pub Dt:	01/02/2014
Title:	SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE

Patent #:	9092567	Issue Dt:	07/28/2015	Application #:	13538496	Filing Dt:	06/29/2012
Publication #:	US20140006875	Pub Dt:	01/02/2014
Title:	SYSTEMS AND METHODS FOR ANALYZING TRANSACTIONS IN A COMPUTER SYSTEM

Patent #:	8790964	Issue Dt:	07/29/2014	Application #:	13538585	Filing Dt:	06/29/2012
Publication #:	US20140001655	Pub Dt:	01/02/2014
Title:	POWER TRANSISTOR WITH HEAT DISSIPATION AND METHOD THEREFOR

Patent #:	8522183	Issue Dt:	08/27/2013	Application #:	13539394	Filing Dt:	06/30/2012
Title:	STATIC TIMING ANALYSIS ADJUSTMENTS FOR AGING EFFECTS

Patent #:	8927345	Issue Dt:	01/06/2015	Application #:	13544430	Filing Dt:	07/09/2012
Publication #:	US20140008811	Pub Dt:	01/09/2014
Title:	DEVICE PACKAGE WITH RIGID INTERCONNECT STRUCTURE CONNECTING DIE AND SUBSTRATE AND METHOD THEREOF

Patent #:	9040355	Issue Dt:	05/26/2015	Application #:	13546902	Filing Dt:	07/11/2012
Publication #:	US20140015123	Pub Dt:	01/16/2014
Title:	SENSOR PACKAGE AND METHOD OF FORMING SAME

Patent #:	8766362	Issue Dt:	07/01/2014	Application #:	13548304	Filing Dt:	07/13/2012
Publication #:	US20120273889	Pub Dt:	11/01/2012
Title:	SHALLOW TRENCH ISOLATION FOR SOI STRUCTURES COMBINING SIDEWALL SPACER AND BOTTOM LINER

Patent #:	9111638	Issue Dt:	08/18/2015	Application #:	13548848	Filing Dt:	07/13/2012
Publication #:	US20140016402	Pub Dt:	01/16/2014
Title:	SRAM BIT CELL WITH REDUCED BIT LINE PRE-CHARGE VOLTAGE

Patent #:	8972785	Issue Dt:	03/03/2015	Application #:	13549040	Filing Dt:	07/13/2012
Publication #:	US20140019806	Pub Dt:	01/16/2014
Title:	CLASSIFYING PROCESSOR TESTCASES

Patent #:	8709875	Issue Dt:	04/29/2014	Application #:	13549518	Filing Dt:	07/16/2012
Publication #:	US20130049183	Pub Dt:	02/28/2013
Title:	POWER DEVICE AND METHOD OF PACKAGING SAME

Patent #:	8643189	Issue Dt:	02/04/2014	Application #:	13550627	Filing Dt:	07/17/2012
Publication #:	US20140021621	Pub Dt:	01/23/2014
Title:	PACKAGED SEMICONDUCTOR DIE WITH POWER RAIL PADS

Patent #:	8461657	Issue Dt:	06/11/2013	Application #:	13550722	Filing Dt:	07/17/2012
Publication #:	US20120282719	Pub Dt:	11/08/2012
Title:	METHODS FOR FORMING A MICRO ELECTRO-MECHANICAL DEVICE

Patent #:	9135195	Issue Dt:	09/15/2015	Application #:	13556257	Filing Dt:	07/24/2012
Publication #:	US20140032803	Pub Dt:	01/30/2014
Title:	PREDICTION OF ELECTRONIC COMPONENT BEHAVIOR IN BUS-BASED SYSTEMS

Patent #:	8685800	Issue Dt:	04/01/2014	Application #:	13560010	Filing Dt:	07/27/2012
Publication #:	US20140027810	Pub Dt:	01/30/2014
Title:	SINGLE-EVENT LATCH-UP PREVENTION TECHNIQUES FOR A SEMICONDUCTOR DEVICE

Patent #:	8716066	Issue Dt:	05/06/2014	Application #:	13562398	Filing Dt:	07/31/2012
Publication #:	US20140038356	Pub Dt:	02/06/2014
Title:	METHOD FOR PLATING A SEMICONDUCTOR PACKAGE LEAD

Patent #:	8707231	Issue Dt:	04/22/2014	Application #:	13562443	Filing Dt:	07/31/2012
Publication #:	US20140040839	Pub Dt:	02/06/2014
Title:	METHOD AND SYSTEM FOR DERIVED LAYER CHECKING FOR SEMICONDUCTOR DEVICE DESIGN

Patent #:	9032615	Issue Dt:	05/19/2015	Application #:	13562534	Filing Dt:	07/31/2012
Publication #:	US20140038317	Pub Dt:	02/06/2014
Title:	METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN METAL LAYERS

Patent #:	8640072	Issue Dt:	01/28/2014	Application #:	13562538	Filing Dt:	07/31/2012
Publication #:	US20140038319	Pub Dt:	02/06/2014
Title:	METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN METAL LAYERS

Patent #:	9146170	Issue Dt:	09/29/2015	Application #:	13562853	Filing Dt:	07/31/2012
Publication #:	US20140033814	Pub Dt:	02/06/2014
Title:	CAPACITIVE PRESSURE SENSOR IN AN OVERMOLDED PACKAGE

Patent #:	9100253	Issue Dt:	08/04/2015	Application #:	13569148	Filing Dt:	08/07/2012
Publication #:	US20140044215	Pub Dt:	02/13/2014
Title:	BLOCK-BASED CREST FACTOR REDUCTION

Patent #:	8589856	Issue Dt:	11/19/2013	Application #:	13577937	Filing Dt:	08/09/2012
Publication #:	US20120317532	Pub Dt:	12/13/2012
Title:	INTEGRATED CIRCUIT DESIGN TOOL APPARATUS AND METHOD OF DESIGNING AN INTEGRATED CIRCUIT

Patent #:	9190390	Issue Dt:	11/17/2015	Application #:	13591924	Filing Dt:	08/22/2012
Publication #:	US20140054783	Pub Dt:	02/27/2014
Title:	STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF

Patent #:	9093457	Issue Dt:	07/28/2015	Application #:	13591969	Filing Dt:	08/22/2012
Publication #:	US20140054796	Pub Dt:	02/27/2014
Title:	STACKED MICROELECTRONIC PACKAGES HAVING PATTERNED SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF

Patent #:	9064977	Issue Dt:	06/23/2015	Application #:	13591990	Filing Dt:	08/22/2012
Publication #:	US20140054797	Pub Dt:	02/27/2014
Title:	STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF

Patent #:	8709868	Issue Dt:	04/29/2014	Application #:	13592764	Filing Dt:	08/23/2012
Publication #:	US20140054798	Pub Dt:	02/27/2014
Title:	SENSOR PACKAGES AND METHOD OF PACKAGING DIES OF DIFFERING SIZES

Patent #:	8531005	Issue Dt:	09/10/2013	Application #:	13593608	Filing Dt:	08/24/2012
Publication #:	US20120326206	Pub Dt:	12/27/2012
Title:	DEVICES WITH ZENER TRIGGERED ESD PROTECTION

Patent #:	8907485	Issue Dt:	12/09/2014	Application #:	13594732	Filing Dt:	08/24/2012
Publication #:	US20140054781	Pub Dt:	02/27/2014
Title:	COPPER BALL BOND FEATURES AND STRUCTURE

Patent #:	8659167	Issue Dt:	02/25/2014	Application #:	13597824	Filing Dt:	08/29/2012
Publication #:	US20140061948	Pub Dt:	03/06/2014
Title:	SENSOR PACKAGING METHOD AND SENSOR PACKAGES

Patent #:	8742599	Issue Dt:	06/03/2014	Application #:	13599388	Filing Dt:	08/30/2012
Publication #:	US20140061952	Pub Dt:	03/06/2014
Title:	IDENTIFICATION MECHANISM FOR SEMICONDUCTOR DEVICE DIE

Patent #:	8836110	Issue Dt:	09/16/2014	Application #:	13600364	Filing Dt:	08/31/2012
Publication #:	US20140061894	Pub Dt:	03/06/2014
Title:	HEAT SPREADER FOR USE WITHIN A PACKAGED SEMICONDUCTOR DEVICE

Patent #:	8884413	Issue Dt:	11/11/2014	Application #:	13600648	Filing Dt:	08/31/2012
Publication #:	US20140061883	Pub Dt:	03/06/2014
Title:	LEADFRAMES, AIR-CAVITY PACKAGES, AND ELECTRONIC DEVICES WITH OFFSET VENT HOLES, AND METHODS OF THEIR MANUFACTURE

Patent #:	8555226	Issue Dt:	10/08/2013	Application #:	13603402	Filing Dt:	09/04/2012
Title:	AUTOMATIC VERIFICATION OF DEPENDENCY

Patent #:	8496158	Issue Dt:	07/30/2013	Application #:	13604641	Filing Dt:	09/06/2012
Publication #:	US20130119114	Pub Dt:	05/16/2013
Title:	METHOD AND APPARATUS FOR MONITORING FREE AIR BALL (FAB) FORMATION IN WIRE BONDING

Patent #:	8643156	Issue Dt:	02/04/2014	Application #:	13605990	Filing Dt:	09/06/2012
Publication #:	US20130234306	Pub Dt:	09/12/2013
Title:	LEAD FRAME FOR ASSEMBLING SEMICONDUCTOR DEVICE

Patent #:	8612915	Issue Dt:	12/17/2013	Application #:	13606858	Filing Dt:	09/07/2012
Title:	Reducing Leakage in Standard Cells

Patent #:	8584063	Issue Dt:	11/12/2013	Application #:	13606980	Filing Dt:	09/07/2012
Title:	ASSERTION-BASED DESIGN PARTITIONING

Patent #:	8432654	Issue Dt:	04/30/2013	Application #:	13612466	Filing Dt:	09/12/2012
Publication #:	US20130010394	Pub Dt:	01/10/2013
Title:	MULTI-VOLTAGE ELECTROSTATIC DISCHARGE PROTECTION

Patent #:	8921994	Issue Dt:	12/30/2014	Application #:	13617851	Filing Dt:	09/14/2012
Publication #:	US20140077349	Pub Dt:	03/20/2014
Title:	Thermally Enhanced Package with Lid Heat Spreader

Patent #:	9159643	Issue Dt:	10/13/2015	Application #:	13618185	Filing Dt:	09/14/2012
Publication #:	US20140077352	Pub Dt:	03/20/2014
Title:	MATRIX LID HEATSPREADER FOR FLIP CHIP PACKAGE

Patent #:	8703507	Issue Dt:	04/22/2014	Application #:	13630996	Filing Dt:	09/28/2012
Publication #:	US20140091475	Pub Dt:	04/03/2014
Title:	METHOD AND APPARATUS TO IMPROVE RELIABILITY OF VIAS

Patent #:	9043378	Issue Dt:	05/26/2015	Application #:	13632616	Filing Dt:	10/01/2012
Publication #:	US20140095572	Pub Dt:	04/03/2014
Title:	Multiply and Accumulate Feedback

Patent #:	8946833	Issue Dt:	02/03/2015	Application #:	13657250	Filing Dt:	10/22/2012
Publication #:	US20140110801	Pub Dt:	04/24/2014
Title:	PACKAGING FOR SEMICONDUCTOR SENSOR DEVICES AND METHODS

Patent #:	8766453	Issue Dt:	07/01/2014	Application #:	13660243	Filing Dt:	10/25/2012
Publication #:	US20140117554	Pub Dt:	05/01/2014
Title:	PACKAGED INTEGRATED CIRCUIT HAVING LARGE SOLDER PADS AND METHOD FOR FORMING

Patent #:	8913456	Issue Dt:	12/16/2014	Application #:	13661861	Filing Dt:	10/26/2012
Publication #:	US20140119100	Pub Dt:	05/01/2014
Title:	SRAM WITH IMPROVED WRITE OPERATION

Patent #:	9407263	Issue Dt:	08/02/2016	Application #:	13665864	Filing Dt:	10/31/2012
Publication #:	US20140117953	Pub Dt:	05/01/2014
Title:	METHOD AND APPARATUS FOR A TUNABLE DRIVER CIRCUIT

Patent #:	9087003	Issue Dt:	07/21/2015	Application #:	13666289	Filing Dt:	11/01/2012
Publication #:	US20140122553	Pub Dt:	05/01/2014
Title:	Vector NCO and Twiddle Factor Generator

Patent #:	9070669	Issue Dt:	06/30/2015	Application #:	13673212	Filing Dt:	11/09/2012
Publication #:	US20140134799	Pub Dt:	05/15/2014
Title:	WETTABLE LEAD ENDS ON A FLAT-PACK NO-LEAD MICROELECTRONIC PACKAGE

Patent #:	8872338	Issue Dt:	10/28/2014	Application #:	13675008	Filing Dt:	11/13/2012
Publication #:	US20140131866	Pub Dt:	05/15/2014
Title:	TRACE ROUTING WITHIN A SEMICONDUCTOR PACKAGE SUBSTRATE

Patent #:	9229051	Issue Dt:	01/05/2016	Application #:	13677800	Filing Dt:	11/15/2012
Publication #:	US20140132315	Pub Dt:	05/15/2014
Title:	INTEGRATED CIRCUIT WITH DEGRADATION MONITORING

Patent #:	9135383	Issue Dt:	09/15/2015	Application #:	13678789	Filing Dt:	11/16/2012
Publication #:	US20140142903	Pub Dt:	05/22/2014
Title:	TABLE MODEL CIRCUIT SIMULATION ACCELERATION USING MODEL CACHING

Patent #:	8836105	Issue Dt:	09/16/2014	Application #:	13681437	Filing Dt:	11/20/2012
Publication #:	US20140027896	Pub Dt:	01/30/2014
Title:	SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT

Patent #:	9401338	Issue Dt:	07/26/2016	Application #:	13688820	Filing Dt:	11/29/2012
Publication #:	US20140145325	Pub Dt:	05/29/2014
Title:	ELECTRONIC DEVICES WITH EMBEDDED DIE INTERCONNECT STRUCTURES, AND METHODS OF MANUFACTURE THEREOF

Patent #:	8802508	Issue Dt:	08/12/2014	Application #:	13689034	Filing Dt:	11/29/2012
Publication #:	US20140147975	Pub Dt:	05/29/2014
Title:	SEMICONDUCTOR DEVICE PACKAGE

Patent #:	9317087	Issue Dt:	04/19/2016	Application #:	13689331	Filing Dt:	11/29/2012
Publication #:	US20130290753	Pub Dt:	10/31/2013
Title:	MEMORY COLUMN DROWSY CONTROL

Patent #:	8535982	Issue Dt:	09/17/2013	Application #:	13689424	Filing Dt:	11/29/2012
Title:	PROVIDING AN AUTOMATIC OPTICAL INSPECTION FEATURE FOR SOLDER JOINTS ON SEMICONDUCTOR PACKAGES

Patent #:	8927417	Issue Dt:	01/06/2015	Application #:	13718081	Filing Dt:	12/18/2012
Publication #:	US20140167262	Pub Dt:	06/19/2014
Title:	SEMICONDUCTOR PACKAGE SIGNAL ROUTING USING CONDUCTIVE VIAS

Patent #:	8645897	Issue Dt:	02/04/2014	Application #:	13735054	Filing Dt:	01/07/2013
Title:	INTEGRATED CIRCUIT DESIGN VERIFICATION SYSTEM

Patent #:	8754518	Issue Dt:	06/17/2014	Application #:	13746874	Filing Dt:	01/22/2013
Title:	DEVICES AND METHODS FOR CONFIGURING CONDUCTIVE ELEMENTS FOR A SEMICONDUCTOR PACKAGE

Patent #:	9098121	Issue Dt:	08/04/2015	Application #:	13746891	Filing Dt:	01/22/2013
Publication #:	US20140207836	Pub Dt:	07/24/2014
Title:	Vector Comparator System for Finding a Peak Number

Patent #:	9172143	Issue Dt:	10/27/2015	Application #:	13751318	Filing Dt:	01/28/2013
Publication #:	US20130135152	Pub Dt:	05/30/2013
Title:	ELECTRONIC DEVICE MODULE WITH INTEGRATED ANTENNA STRUCTURE, AND RELATED MANUFACTURING METHOD

Patent #:	9466544	Issue Dt:	10/11/2016	Application #:	13754086	Filing Dt:	01/30/2013
Publication #:	US20140210063	Pub Dt:	07/31/2014
Title:	SEMICONDUCITIVE CATECHOL GROUP ENCAPSULANT ADHESION PROMOTER FOR A PACKAGED ELECTRONIC DEVICE

Patent #:	9111878	Issue Dt:	08/18/2015	Application #:	13755904	Filing Dt:	01/31/2013
Publication #:	US20140213018	Pub Dt:	07/31/2014
Title:	METHOD FOR FORMNG A SEMICONDUCTOR DEVICE ASSEMBLY HAVING A HEAT SPREADER

Patent #:	8710636	Issue Dt:	04/29/2014	Application #:	13758263	Filing Dt:	02/04/2013
Title:	LEAD FRAME ARRAY PACKAGE WITH FLIP CHIP DIE ATTACH

Patent #:	8970026	Issue Dt:	03/03/2015	Application #:	13764958	Filing Dt:	02/12/2013
Publication #:	US20140225268	Pub Dt:	08/14/2014
Title:	METHODS AND STRUCTURES FOR REDUCING STRESS ON DIE ASSEMBLY

Patent #:	8741666	Issue Dt:	06/03/2014	Application #:	13766445	Filing Dt:	02/13/2013
Title:	METHODS RELATING TO INTERMETALLIC TESTING OF BOND INTEGRITY BETWEEN BOND PADS AND COPPER-CONTAINING BOND WIRES

Patent #:	8809078	Issue Dt:	08/19/2014	Application #:	13766771	Filing Dt:	02/13/2013
Publication #:	US20140225211	Pub Dt:	08/14/2014
Title:	SOLAR POWERED IC CHIP

Patent #:	8656331	Issue Dt:	02/18/2014	Application #:	13767064	Filing Dt:	02/14/2013
Title:	Timing Margins for On-chip Variations from Sensitivity Data

Patent #:	8853840	Issue Dt:	10/07/2014	Application #:	13773594	Filing Dt:	02/21/2013
Publication #:	US20140231978	Pub Dt:	08/21/2014
Title:	SEMICONDUCTOR PACKAGE WITH INNER AND OUTER LEADS

Patent #:	9209081	Issue Dt:	12/08/2015	Application #:	13773603	Filing Dt:	02/21/2013
Publication #:	US20140231980	Pub Dt:	08/21/2014
Title:	SEMICONDUCTOR GRID ARRAY PACKAGE

Patent #:	8946000	Issue Dt:	02/03/2015	Application #:	13774486	Filing Dt:	02/22/2013
Publication #:	US20140239440	Pub Dt:	08/28/2014
Title:	Thin Beam Deposited Fuse

100

Patent #:	9041103	Issue Dt:	05/26/2015	Application #:	13781722	Filing Dt:	02/28/2013
Publication #:	US20130175616	Pub Dt:	07/11/2013
Title:	RESURF SEMICONDUCTOR DEVICE CHARGE BALANCING

Assignor

FREESCALE SEMICONDUCTOR INC.

Exec Dt:

11/07/2016

Assignee

NXP USA, INC.

6501 WILLIAM CANNON DRIVE WEST

AUSTIN, TEXAS 78735

Correspondence name and address
	NXP USA, INC.
	6501 WILLIAM CANNON DRIVE WEST
	AUSTIN, TX 78735

Search Results as of: 06/20/2024 03:52 AM

If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6

Web interface last modified: August 25, 2017 v.2.6