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Reel/Frame:	044209/0047			Pages:	69
		Recorded:	09/21/2017
Attorney Dkt #:	FSL NXP CORRECTIVE ASSGN
Conveyance:	CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040632 FRAME: 0001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME.

Total properties: 1087
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Patent #:	8963318	Issue Dt:	02/24/2015	Application #:	13781732	Filing Dt:	02/28/2013
Publication #:	US20140239497	Pub Dt:	08/28/2014
Title:	PACKAGED SEMICONDUCTOR DEVICE

Patent #:	9190708	Issue Dt:	11/17/2015	Application #:	13785482	Filing Dt:	03/05/2013
Publication #:	US20140253258	Pub Dt:	09/11/2014
Title:	SYSTEM FOR REDUCING ELECTROMAGNETIC INDUCTION INTERFERENCE

Patent #:	9026970	Issue Dt:	05/05/2015	Application #:	13788046	Filing Dt:	03/07/2013
Publication #:	US20140258951	Pub Dt:	09/11/2014
Title:	Prioritized Design for Manufacturing Virtualization with Design Rule Checking Filtering

Patent #:	8859339	Issue Dt:	10/14/2014	Application #:	13794789	Filing Dt:	03/12/2013
Publication #:	US20130196473	Pub Dt:	08/01/2013
Title:	MOLD CHASE

Patent #:	8836091	Issue Dt:	09/16/2014	Application #:	13794841	Filing Dt:	03/12/2013
Publication #:	US20140264793	Pub Dt:	09/18/2014
Title:	LEAD FRAME FOR SEMICONDUCTOR PACKAGE WITH ENHANCED STRESS RELIEF

Patent #:	8680660	Issue Dt:	03/25/2014	Application #:	13798052	Filing Dt:	03/12/2013
Title:	BRACE FOR BOND WIRE

Patent #:	9111952	Issue Dt:	08/18/2015	Application #:	13798980	Filing Dt:	03/13/2013
Publication #:	US20140273352	Pub Dt:	09/18/2014
Title:	SEMICONDUCTOR DEVICE

Patent #:	8754521	Issue Dt:	06/17/2014	Application #:	13799031	Filing Dt:	03/13/2013
Title:	SEMICONDUCTOR DEVICE ASSEMBLY HAVING A HEAT SPREADER

Patent #:	9299670	Issue Dt:	03/29/2016	Application #:	13829737	Filing Dt:	03/14/2013
Publication #:	US20140264945	Pub Dt:	09/18/2014
Title:	STACKED MICROELECTRONIC PACKAGES HAVING SIDEWALL CONDUCTORS AND METHODS FOR THE FABRICATION THEREOF

Patent #:	9372729	Issue Dt:	06/21/2016	Application #:	13833509	Filing Dt:	03/15/2013
Publication #:	US20130212591	Pub Dt:	08/15/2013
Title:	TASK SCHEDULING METHOD AND APPARATUS

Patent #:	8766703	Issue Dt:	07/01/2014	Application #:	13835690	Filing Dt:	03/15/2013
Title:	Method and Apparatus for Sensing On-Chip Characteristics

Patent #:	9465899	Issue Dt:	10/11/2016	Application #:	13837565	Filing Dt:	03/15/2013
Publication #:	US20140282340	Pub Dt:	09/18/2014
Title:	METHOD FOR PROVISIONING DECOUPLING CAPACITANCE IN AN INTEGRATED CIRCUIT

Patent #:	8907464	Issue Dt:	12/09/2014	Application #:	13848734	Filing Dt:	03/22/2013
Publication #:	US20140146497	Pub Dt:	05/29/2014
Title:	HELIX SUBSTRATE AND THREE-DIMENSIONAL PACKAGE WITH SAME

Patent #:	8778704	Issue Dt:	07/15/2014	Application #:	13849543	Filing Dt:	03/24/2013
Title:	SOLAR POWERED IC CHIP

Patent #:	8878348	Issue Dt:	11/04/2014	Application #:	13854137	Filing Dt:	04/01/2013
Publication #:	US20140070388	Pub Dt:	03/13/2014
Title:	SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME

Patent #:	8772913	Issue Dt:	07/08/2014	Application #:	13857131	Filing Dt:	04/04/2013
Title:	STIFFENED SEMICONDUCTOR DIE PACKAGE

Patent #:	8669140	Issue Dt:	03/11/2014	Application #:	13857143	Filing Dt:	04/04/2013
Title:	METHOD OF FORMING STACKED DIE PACKAGE USING REDISTRIBUTED CHIP PACKAGING

Patent #:	8762898	Issue Dt:	06/24/2014	Application #:	13861509	Filing Dt:	04/12/2013
Title:	DOUBLE PATTERNING AWARE ROUTING WITHOUT STITCHING

Patent #:	8860212	Issue Dt:	10/14/2014	Application #:	13862473	Filing Dt:	04/15/2013
Publication #:	US20140306336	Pub Dt:	10/16/2014
Title:	FLUID COOLED SEMICONDUCTOR DIE PACKAGE

Patent #:	8759885	Issue Dt:	06/24/2014	Application #:	13873217	Filing Dt:	04/30/2013
Title:	STANDARD CELL FOR SEMICONDUCTOR DEVICE

Patent #:	9449129	Issue Dt:	09/20/2016	Application #:	13873621	Filing Dt:	04/30/2013
Publication #:	US20140324398	Pub Dt:	10/30/2014
Title:	METHOD AND APPARATUS FOR ACCELERATING SPARSE MATRIX OPERATIONS IN FULL ACCURACY CIRCUIT SIMULATION

Patent #:	9043737	Issue Dt:	05/26/2015	Application #:	13873655	Filing Dt:	04/30/2013
Publication #:	US20140325463	Pub Dt:	10/30/2014
Title:	Integrated Circuit Design Verification Through Forced Clock Glitches

Patent #:	9362280	Issue Dt:	06/07/2016	Application #:	13893026	Filing Dt:	05/13/2013
Publication #:	US20130249015	Pub Dt:	09/26/2013
Title:	SEMICONDUCTOR DEVICES WITH DIFFERENT DIELECTRIC THICKNESSES

Patent #:	8836098	Issue Dt:	09/16/2014	Application #:	13894440	Filing Dt:	05/15/2013
Title:	SURFACE MOUNT SEMICONDUCTOR DEVICE WITH SOLDER BALL REINFORCEMENT FRAME

Patent #:	9412709	Issue Dt:	08/09/2016	Application #:	13898949	Filing Dt:	05/21/2013
Publication #:	US20140346663	Pub Dt:	11/27/2014
Title:	SEMICONDUCTOR STRUCTURE WITH SACRIFICIAL ANODE AND PASSIVATION LAYER AND METHOD FOR FORMING

Patent #:	8698288	Issue Dt:	04/15/2014	Application #:	13901563	Filing Dt:	05/23/2013
Title:	FLEXIBLE SUBSTRATE WITH CRIMPING INTERCONNECTION

Patent #:	9111937	Issue Dt:	08/18/2015	Application #:	13903230	Filing Dt:	05/28/2013
Publication #:	US20140353830	Pub Dt:	12/04/2014
Title:	SEMICONDUCTOR DEVICES WITH MULTILAYER FLEX INTERCONNECT STRUCTURES

Patent #:	9029202	Issue Dt:	05/12/2015	Application #:	13903308	Filing Dt:	05/28/2013
Publication #:	US20140353816	Pub Dt:	12/04/2014
Title:	METHOD OF FORMING A HIGH THERMAL CONDUCTING SEMICONDUCTOR DEVICE PACKAGE

Patent #:	8962389	Issue Dt:	02/24/2015	Application #:	13906161	Filing Dt:	05/30/2013
Publication #:	US20140353772	Pub Dt:	12/04/2014
Title:	MICROELECTRONIC PACKAGES INCLUDING PATTERNED DIE ATTACH MATERIAL AND METHODS FOR THE FABRICATION THEREOF

Patent #:	9082824	Issue Dt:	07/14/2015	Application #:	13907119	Filing Dt:	05/31/2013
Publication #:	US20140353841	Pub Dt:	12/04/2014
Title:	METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN METAL LAYERS

Patent #:	8765527	Issue Dt:	07/01/2014	Application #:	13917639	Filing Dt:	06/13/2013
Title:	SEMICONDUCTOR DEVICE WITH REDISTRIBUTED CONTACTS

Patent #:	9030000	Issue Dt:	05/12/2015	Application #:	13917641	Filing Dt:	06/14/2013
Publication #:	US20140367840	Pub Dt:	12/18/2014
Title:	MOLD CAP FOR SEMICONDUCTOR DEVICE

Patent #:	9100261	Issue Dt:	08/04/2015	Application #:	13924792	Filing Dt:	06/24/2013
Publication #:	US20140376648	Pub Dt:	12/25/2014
Title:	Frequency-Domain Amplitude Normalization For Symbol Correlation In Multi-Carrier Systems

Patent #:	9106499	Issue Dt:	08/11/2015	Application #:	13924996	Filing Dt:	06/24/2013
Publication #:	US20140376674	Pub Dt:	12/25/2014
Title:	Frequency-Domain Frame Synchronization In Multi-Carrier Systems

Patent #:	9282525	Issue Dt:	03/08/2016	Application #:	13925023	Filing Dt:	06/24/2013
Publication #:	US20140376540	Pub Dt:	12/25/2014
Title:	Frequency-Domain Symbol And Frame Synchronization In Multi-Carrier Systems

Patent #:	9287200	Issue Dt:	03/15/2016	Application #:	13928876	Filing Dt:	06/27/2013
Publication #:	US20150001691	Pub Dt:	01/01/2015
Title:	PACKAGED SEMICONDUCTOR DEVICE

Patent #:	9000507	Issue Dt:	04/07/2015	Application #:	13929013	Filing Dt:	06/27/2013
Publication #:	US20150002211	Pub Dt:	01/01/2015
Title:	METHOD AND SYSTEM FOR RECOVERING FROM TRANSISTOR AGING USING HEATING

Patent #:	8981541	Issue Dt:	03/17/2015	Application #:	13938231	Filing Dt:	07/10/2013
Publication #:	US20150014833	Pub Dt:	01/15/2015
Title:	QUAD FLAT SEMICONDUCTOR DEVICE WITH ADDITIONAL CONTACTS

Patent #:	8987881	Issue Dt:	03/24/2015	Application #:	13938232	Filing Dt:	07/10/2013
Publication #:	US20150014834	Pub Dt:	01/15/2015
Title:	HYBRID LEAD FRAME AND BALL GRID ARRAY PACKAGE

Patent #:	9000570	Issue Dt:	04/07/2015	Application #:	13939183	Filing Dt:	07/11/2013
Publication #:	US20150014831	Pub Dt:	01/15/2015
Title:	SEMICONDUCTOR DEVICE WITH CORNER TIE BARS

Patent #:	9123685	Issue Dt:	09/01/2015	Application #:	13942518	Filing Dt:	07/15/2013
Publication #:	US20150014838	Pub Dt:	01/15/2015
Title:	MICROELECTRONIC PACKAGES HAVING FRONTSIDE THERMAL CONTACTS AND METHODS FOR THE FABRICATION THEREOF

Patent #:	9018045	Issue Dt:	04/28/2015	Application #:	13942540	Filing Dt:	07/15/2013
Publication #:	US20150014855	Pub Dt:	01/15/2015
Title:	MICROELECTRONIC PACKAGES AND METHODS FOR THE FABRICATION THEREOF

Patent #:	8822268	Issue Dt:	09/02/2014	Application #:	13944774	Filing Dt:	07/17/2013
Title:	REDISTRIBUTED CHIP PACKAGES CONTAINING MULTIPLE COMPONENTS AND METHODS FOR THE FABRICATION THEREOF

Patent #:	9153644	Issue Dt:	10/06/2015	Application #:	13945746	Filing Dt:	07/18/2013
Publication #:	US20150021746	Pub Dt:	01/22/2015
Title:	BACKSCATTERING FOR LOCALIZED ANNEALING

Patent #:	9108842	Issue Dt:	08/18/2015	Application #:	13946729	Filing Dt:	07/19/2013
Publication #:	US20150021717	Pub Dt:	01/22/2015
Title:	REDUCING MICROELECTROMECHANICAL SYSTEMS STICTION BY FORMATION OF A SILICON CARBIDE LAYER

Patent #:	8895409	Issue Dt:	11/25/2014	Application #:	13948927	Filing Dt:	07/23/2013
Publication #:	US20130309860	Pub Dt:	11/21/2013
Title:	SEMICONDUCTOR WAFER PLATING BUS AND METHOD FOR FORMING

Patent #:	9426884	Issue Dt:	08/23/2016	Application #:	13950618	Filing Dt:	07/25/2013
Publication #:	US20150027767	Pub Dt:	01/29/2015
Title:	SYSTEM AND METHOD FOR LEAD FRAME PACKAGE DEGATING

Patent #:	9122829	Issue Dt:	09/01/2015	Application #:	13956044	Filing Dt:	07/31/2013
Publication #:	US20150040092	Pub Dt:	02/05/2015
Title:	Stress Migration Mitigation

Patent #:	9443804	Issue Dt:	09/13/2016	Application #:	13956068	Filing Dt:	07/31/2013
Publication #:	US20150035151	Pub Dt:	02/05/2015
Title:	CAPPING LAYER INTERFACE INTERRUPTION FOR STRESS MIGRATION MITIGATION

Patent #:	9329229	Issue Dt:	05/03/2016	Application #:	13956126	Filing Dt:	07/31/2013
Publication #:	US20140132293	Pub Dt:	05/15/2014
Title:	INTEGRATED CIRCUIT WITH DEGRADATION MONITORING

Patent #:	8901721	Issue Dt:	12/02/2014	Application #:	13972885	Filing Dt:	08/21/2013
Publication #:	US20140361421	Pub Dt:	12/11/2014
Title:	LEAD FRAME BASED SEMICONDUCTOR DIE PACKAGE

Patent #:	9171117	Issue Dt:	10/27/2015	Application #:	14003361	Filing Dt:	09/05/2013
Publication #:	US20140013294	Pub Dt:	01/09/2014
Title:	METHOD FOR RANKING PATHS FOR POWER OPTIMIZATION OF AN INTEGRATED CIRCUIT DESIGN AND CORRESPONDING COMPUTER PROGRAM PRODUCT

Patent #:	8941194	Issue Dt:	01/27/2015	Application #:	14010557	Filing Dt:	08/27/2013
Title:	PRESSURE SENSOR DEVICE HAVING BUMP CHIP CARRIER (BCC)

Patent #:	9090454	Issue Dt:	07/28/2015	Application #:	14011289	Filing Dt:	08/27/2013
Publication #:	US20150061044	Pub Dt:	03/05/2015
Title:	SEQUENTIAL WAFER BONDING

Patent #:	9024429	Issue Dt:	05/05/2015	Application #:	14013923	Filing Dt:	08/29/2013
Publication #:	US20150061139	Pub Dt:	03/05/2015
Title:	MICROELECTRONIC PACKAGES CONTAINING OPPOSING DEVICES AND METHODS FOR THE FABRICATION THEREOF

Patent #:	9471785	Issue Dt:	10/18/2016	Application #:	14015429	Filing Dt:	08/30/2013
Publication #:	US20150067313	Pub Dt:	03/05/2015
Title:	SYSTEMS AND METHODS FOR SECURE BOOT ROM PATCH

Patent #:	9159682	Issue Dt:	10/13/2015	Application #:	14020841	Filing Dt:	09/08/2013
Publication #:	US20150069603	Pub Dt:	03/12/2015
Title:	COPPER PILLAR BUMP AND FLIP CHIP PACKAGE USING SAME

Patent #:	9064838	Issue Dt:	06/23/2015	Application #:	14029779	Filing Dt:	09/17/2013
Publication #:	US20150076680	Pub Dt:	03/19/2015
Title:	HEAT SPREADER FOR INTEGRATED CIRCUIT DEVICE

Patent #:	9040335	Issue Dt:	05/26/2015	Application #:	14029783	Filing Dt:	09/17/2013
Publication #:	US20150076630	Pub Dt:	03/19/2015
Title:	SIDE VENTED PRESSURE SENSOR DEVICE

Patent #:	9281256	Issue Dt:	03/08/2016	Application #:	14035999	Filing Dt:	09/25/2013
Publication #:	US20150084168	Pub Dt:	03/26/2015
Title:	PACKAGE ENCAPSULANT RELIEF FEATURE

Patent #:	9036363	Issue Dt:	05/19/2015	Application #:	14042623	Filing Dt:	09/30/2013
Publication #:	US20150092372	Pub Dt:	04/02/2015
Title:	DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH PARALLEL CONDUCTORS AND INTRA-CONDUCTOR ISOLATOR STRUCTURES AND METHODS OF THEIR FABRICATION

Patent #:	9025340	Issue Dt:	05/05/2015	Application #:	14042628	Filing Dt:	09/30/2013
Publication #:	US20150092377	Pub Dt:	04/02/2015
Title:	DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH IN-TRENCH PACKAGE SURFACE CONDUCTORS AND METHODS OF THEIR FABRICATION

Patent #:	9437574	Issue Dt:	09/06/2016	Application #:	14042662	Filing Dt:	09/30/2013
Publication #:	US20150090480	Pub Dt:	04/02/2015
Title:	ELECTRONIC COMPONENT PACKAGE AND METHOD FOR FORMING SAME

Patent #:	9112754	Issue Dt:	08/18/2015	Application #:	14048139	Filing Dt:	10/08/2013
Publication #:	US20150098514	Pub Dt:	04/09/2015
Title:	TECHNIQUES FOR GENERATING BIT LOG-LIKELIHOOD RATIOS IN COMMUNICATION SYSTEMS USING DIFFERENTIAL MODULATION

Patent #:	9385909	Issue Dt:	07/05/2016	Application #:	14048172	Filing Dt:	10/08/2013
Publication #:	US20150098530	Pub Dt:	04/09/2015
Title:	Detecting Repeated Preamble Symbols Using Over-Sized Discrete Fourier Transforms

Patent #:	9111870	Issue Dt:	08/18/2015	Application #:	14056844	Filing Dt:	10/17/2013
Publication #:	US20150108661	Pub Dt:	04/23/2015
Title:	MICROELECTRONIC PACKAGES CONTAINING STACKED MICROELECTRONIC DEVICES AND METHODS FOR THE FABRICATION THEREOF

Patent #:	9129951	Issue Dt:	09/08/2015	Application #:	14056930	Filing Dt:	10/17/2013
Publication #:	US20150108623	Pub Dt:	04/23/2015
Title:	COATED LEAD FRAME BOND FINGER

Patent #:	8954903	Issue Dt:	02/10/2015	Application #:	14064225	Filing Dt:	10/28/2013
Title:	METHOD OF ADDING FEATURES TO PARAMETERIZED CELLS

Patent #:	8898612	Issue Dt:	11/25/2014	Application #:	14066696	Filing Dt:	10/30/2013
Title:	SYSTEM FOR PLACING DUMMY TILES IN METAL LAYERS OF INTEGRATED CIRCUIT DESIGN

Patent #:	9281293	Issue Dt:	03/08/2016	Application #:	14067809	Filing Dt:	10/30/2013
Publication #:	US20150115454	Pub Dt:	04/30/2015
Title:	MICROELECTRONIC PACKAGES HAVING LAYERED INTERCONNECT STRUCTURES AND METHODS FOR THE MANUFACTURE THEREOF

Patent #:	9012263	Issue Dt:	04/21/2015	Application #:	14069103	Filing Dt:	10/31/2013
Publication #:	US20150118791	Pub Dt:	04/30/2015
Title:	METHOD FOR TREATING A BOND PAD OF A PACKAGE SUBSTRATE

Patent #:	8995178	Issue Dt:	03/31/2015	Application #:	14069192	Filing Dt:	10/31/2013
Title:	SRAM WITH EMBEDDED ROM

Patent #:	9069042	Issue Dt:	06/30/2015	Application #:	14072295	Filing Dt:	11/05/2013
Publication #:	US20150128001	Pub Dt:	05/07/2015
Title:	Efficient Apparatus and Method for Testing Digital Shadow Logic Around Non-Logic Design Structures

Patent #:	8969135	Issue Dt:	03/03/2015	Application #:	14077174	Filing Dt:	11/11/2013
Publication #:	US20140246767	Pub Dt:	09/04/2014
Title:	SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME

Patent #:	8901722	Issue Dt:	12/02/2014	Application #:	14077205	Filing Dt:	11/11/2013
Publication #:	US20140239476	Pub Dt:	08/28/2014
Title:	SEMICONDUCTOR DEVICE WITH INTEGRAL HEAT SINK

Patent #:	9123645	Issue Dt:	09/01/2015	Application #:	14086545	Filing Dt:	11/21/2013
Publication #:	US20140087550	Pub Dt:	03/27/2014
Title:	METHODS OF MAKING SEMICONDUCTOR DEVICES WITH LOW LEAKAGE SCHOTKY CONTACTS

Patent #:	9136399	Issue Dt:	09/15/2015	Application #:	14086919	Filing Dt:	11/21/2013
Publication #:	US20150137278	Pub Dt:	05/21/2015
Title:	SEMICONDUCTOR PACKAGE WITH GEL FILLED CAVITY

Patent #:	8933547	Issue Dt:	01/13/2015	Application #:	14086929	Filing Dt:	11/21/2013
Title:	LEAD FRAME WITH POWER BAR FOR SEMICONDUCTOR DEVICE

Patent #:	9053972	Issue Dt:	06/09/2015	Application #:	14086932	Filing Dt:	11/21/2013
Publication #:	US20150137354	Pub Dt:	05/21/2015
Title:	PILLAR BUMP FORMED USING SPOT-LASER

Patent #:	9190352	Issue Dt:	11/17/2015	Application #:	14086942	Filing Dt:	11/21/2013
Publication #:	US20150137279	Pub Dt:	05/21/2015
Title:	MULTI-DIE SENSOR DEVICE

Patent #:	9257403	Issue Dt:	02/09/2016	Application #:	14090086	Filing Dt:	11/26/2013
Publication #:	US20150145148	Pub Dt:	05/28/2015
Title:	Copper Ball Bond Interface Structure and Formation

Patent #:	9129981	Issue Dt:	09/08/2015	Application #:	14090975	Filing Dt:	11/26/2013
Publication #:	US20150145108	Pub Dt:	05/28/2015
Title:	METHODS FOR THE PRODUCTION OF MICROELECTRONIC PACKAGES HAVING RADIOFREQUENCY STAND-OFF LAYERS

Patent #:	9263100	Issue Dt:	02/16/2016	Application #:	14093123	Filing Dt:	11/29/2013
Publication #:	US20150155017	Pub Dt:	06/04/2015
Title:	BYPASS SYSTEM AND METHOD THAT MIMICS CLOCK TO DATA MEMORY READ TIMING

Patent #:	9494987	Issue Dt:	11/15/2016	Application #:	14093473	Filing Dt:	11/30/2013
Publication #:	US20150153811	Pub Dt:	06/04/2015
Title:	PROCESSING SYSTEM WITH LOW POWER WAKE-UP PAD

Patent #:	8972922	Issue Dt:	03/03/2015	Application #:	14096051	Filing Dt:	12/04/2013
Publication #:	US20140094029	Pub Dt:	04/03/2014
Title:	METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN METAL LAYERS

Patent #:	9263420	Issue Dt:	02/16/2016	Application #:	14097424	Filing Dt:	12/05/2013
Publication #:	US20150162309	Pub Dt:	06/11/2015
Title:	DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH PACKAGE SURFACE CONDUCTORS AND METHODS OF THEIR FABRICATION

Patent #:	9305911	Issue Dt:	04/05/2016	Application #:	14097459	Filing Dt:	12/05/2013
Publication #:	US20150162310	Pub Dt:	06/11/2015
Title:	DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH PACKAGE SURFACE CONDUCTORS AND ADJACENT TRENCHES AND METHODS OF THEIR FABRICATION

Patent #:	9134193	Issue Dt:	09/15/2015	Application #:	14098559	Filing Dt:	12/06/2013
Publication #:	US20150160087	Pub Dt:	06/11/2015
Title:	STACKED DIE SENSOR PACKAGE

Patent #:	9018029	Issue Dt:	04/28/2015	Application #:	14099502	Filing Dt:	12/06/2013
Title:	Vent Hole Sealing in Multiple Die Sensor Device

Patent #:	8843873	Issue Dt:	09/23/2014	Application #:	14100005	Filing Dt:	12/08/2013
Title:	CAPACITIVE CELL LOAD ESTIMATION USING ELECTROMIGRATION ANALYSIS

Patent #:	9384856	Issue Dt:	07/05/2016	Application #:	14102727	Filing Dt:	12/11/2013
Publication #:	US20150162098	Pub Dt:	06/11/2015
Title:	MEMORIES HAVING A BUILT-IN SELF-TEST (BIST) FEATURE

Patent #:	9264040	Issue Dt:	02/16/2016	Application #:	14134082	Filing Dt:	12/19/2013
Publication #:	US20150180452	Pub Dt:	06/25/2015
Title:	LOW LEAKAGE CMOS CELL WITH LOW VOLTAGE SWING

Patent #:	9009644	Issue Dt:	04/14/2015	Application #:	14136057	Filing Dt:	12/20/2013
Title:	AUTOMATIC GENERATION OF VIA DEFINITIONS BASED ON MANUFACTURABILITY

Patent #:	9008223	Issue Dt:	04/14/2015	Application #:	14140123	Filing Dt:	12/24/2013
Title:	TRANSMITTER AND METHOD FOR REDUCING THE PEAK-TO-AVERAGE POWER RATIO OF A DIGITALLY MODULATED COMMUNICATION SIGNAL

Patent #:	9190353	Issue Dt:	11/17/2015	Application #:	14142924	Filing Dt:	12/30/2013
Publication #:	US20140252581	Pub Dt:	09/11/2014
Title:	LEAD FRAME AND SUBSTRATE SEMICONDUCTOR PACKAGE

Patent #:	9288848	Issue Dt:	03/15/2016	Application #:	14144720	Filing Dt:	12/31/2013
Publication #:	US20150182995	Pub Dt:	07/02/2015
Title:	APPARATUS FABRICATION USING LOCALIZED ANNEALING

Patent #:	9006874	Issue Dt:	04/14/2015	Application #:	14147599	Filing Dt:	01/06/2014
Publication #:	US20140120664	Pub Dt:	05/01/2014
Title:	LEAD FRAME WITH GROOVED LEAD FINGER

Patent #:	9306543	Issue Dt:	04/05/2016	Application #:	14149219	Filing Dt:	01/07/2014
Publication #:	US20150194949	Pub Dt:	07/09/2015
Title:	TEMPERATURE-COMPENSATED HIGH ACCURACY CLOCK

Patent #:	9362234	Issue Dt:	06/07/2016	Application #:	14149335	Filing Dt:	01/07/2014
Publication #:	US20150194388	Pub Dt:	07/09/2015
Title:	SHIELDED DEVICE PACKAGES HAVING ANTENNAS AND RELATED FABRICATION METHODS

100

Patent #:	9165886	Issue Dt:	10/20/2015	Application #:	14151305	Filing Dt:	01/09/2014
Publication #:	US20140124958	Pub Dt:	05/08/2014
Title:	SENSOR PACKAGING METHOD AND SENSOR PACKAGES

Assignor

FREESCALE SEMICONDUCTOR INC.

Exec Dt:

11/07/2016

Assignee

NXP USA, INC.

6501 WILLIAM CANNON DRIVE WEST

AUSTIN, TEXAS 78735

Correspondence name and address
	NXP USA, INC.
	6501 WILLIAM CANNON DRIVE WEST
	AUSTIN, TX 78735

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