Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 018223/0047 | |
| Pages: | 3 |
| | Recorded: | 09/11/2006 | | |
| Attorney Dkt #: | 18287-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11309680
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Filing Dt:
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09/11/2006
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Publication #:
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Pub Dt:
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07/05/2007
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Title:
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ARRAY CIRCUIT SUBSTRATE AND WIRE BONDING PROCESS USING THE SAME
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Assignee
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| 26, CHIN 3RD. RD., 811, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7 FLOOR-1, NO. 100
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ROOSEVELT ROAD, SECTION 2
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TAIPEI, TAIWAN 100
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