Patent Assignment Details
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Reel/Frame: | 021791/0047 | |
| Pages: | 3 |
| | Recorded: | 11/05/2008 | | |
Attorney Dkt #: | HKY-18647 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12265191
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Filing Dt:
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11/05/2008
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Publication #:
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Pub Dt:
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05/14/2009
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Title:
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COMPONENT FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF COMPONENT FOR SEMICONDUCTOR PACKAGE
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Assignee
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80, OSHIMADA-MACHI |
NAGANO-SHI, NAGANO, JAPAN 381-2287 |
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Correspondence name and address
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RANKIN HILL AND CLARK LLP
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38210 GLENN AVENUE
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WILLOUGHBY, OH 44094
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