Patent Assignment Details
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| Reel/Frame: | 029311/0047 | |
| Pages: | 9 |
| | Recorded: | 11/16/2012 | | |
| Attorney Dkt #: | 25031US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/15/2015
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Application #:
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13678058
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Filing Dt:
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11/15/2012
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Publication #:
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Pub Dt:
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05/15/2014
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Title:
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METHOD AND SYSTEM FOR A SEMICONDUCTOR FOR DEVICE PACKAGE WITH A DIE-TO-PACKAGING SUBSTRATE FIRST BOND
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Assignee
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| 1900 SOUTH PRICE ROAD |
| CHANDLER, ARIZONA 85286-6604 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY
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500 WEST MADISON ST.
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34TH FLOOR
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CHICAGO, IL 60661
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