Patent Assignment Details
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| Reel/Frame: | 006967/0050 | |
| Pages: | 3 |
| | Recorded: | 03/09/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/09/1996
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Application #:
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08209665
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Filing Dt:
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03/09/1994
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Title:
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METHOD FOR CIRCUITS CONNECTION FOR WAFER LEVEL BURNING AND TESTING OF INDIVIDUAL DIES ON SEMICONDUCTOR WAFER
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Assignee
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| MAIL STOP 507 |
| PATENT DEPT. 2805 E. COLUMBIA RD. |
| BOISE, IDAHO 83706 |
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Correspondence name and address
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STANLEY N. PROTIGAL
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MAIL STOP 507, PATENT DEPT.
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2805 E. COLUMBIA RD.
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BOISE, ID 83706
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