Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 019087/0051 | |
| Pages: | 3 |
| | Recorded: | 03/29/2007 | | |
| Attorney Dkt #: | CHANG=223 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/30/2010
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Application #:
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10583149
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Filing Dt:
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06/16/2006
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Publication #:
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Pub Dt:
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06/21/2007
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Title:
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METHOD FOR BONDING PLASTIC MICRO CHIP
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Assignee
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| SEOUL NATIONAL UNIVERSITY INSTITUTE OF ADVANCED MACHINERY 1304 |
| SAN 56-1 SHINLIM |
| KWANAK, SEOUL, KOREA, REPUBLIC OF 151-742 |
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Correspondence name and address
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BROWDY AND NEIMARK PLLC
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624 NINTH STREET NW
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SUITE 300
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WASHINGTON, DC 20001-5303
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