Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 021620/0051 | |
| Pages: | 3 |
| | Recorded: | 10/01/2008 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12077174
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Filing Dt:
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03/17/2008
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Publication #:
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Pub Dt:
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09/17/2009
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Title:
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Method for producing a semiconductor device and the semiconductor device
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Patent #:
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Issue Dt:
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01/03/2012
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Application #:
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12077175
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Filing Dt:
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03/17/2008
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Publication #:
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Pub Dt:
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09/17/2009
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Title:
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WIRING STRUCTURE OF A SUBSTRATE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12077177
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Filing Dt:
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03/17/2008
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Publication #:
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Pub Dt:
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09/17/2009
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Title:
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Semiconductor device and bypass capacitor module
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12077178
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Filing Dt:
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03/17/2008
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Publication #:
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Pub Dt:
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09/17/2009
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Title:
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Power controller for a mounting substrate and a semiconductor substrate
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Patent #:
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Issue Dt:
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08/14/2012
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Application #:
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12077179
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Filing Dt:
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03/17/2008
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Publication #:
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Pub Dt:
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09/17/2009
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Title:
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BSC MACROSTRUCTURE FOR THREE-DIMENSIONAL WIRING AND SUBSTRATE HAVING THE BSC MACROSTRUCTURE
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Assignee
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| 2-22-7-502, TAKASAGO |
| KATSUSHIKA-KU, TOKYO 125-0054, JAPAN |
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Correspondence name and address
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COLLARD & ROE, P.C.
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1077 NORTHERN BOULEVARD
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ROSLYN, NY 11576
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