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Reel/Frame:025307/0051   Pages: 2
Recorded: 11/05/2010
Attorney Dkt #:1938.1274
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12926279
Filing Dt:
11/05/2010
Publication #:
Pub Dt:
06/09/2011
Title:
Package substrate and method of fabricating the same
Assignors
1
Exec Dt:
05/10/2010
2
Exec Dt:
05/10/2010
3
Exec Dt:
05/10/2010
4
Exec Dt:
05/10/2010
5
Exec Dt:
05/10/2010
Assignee
1
314 MAETAN-3-DONG, YEONGTONG-GU,
SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Correspondence name and address
STAAS & HALSEY LLP
ATTENTION: JOHN C. GARVEY
1201 NEW YORK AVE., N.W., SUITE 700
WASHINGTON, D.C. 20005

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