Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 052952/0051 | |
| Pages: | 5 |
| | Recorded: | 06/16/2020 | | |
| Attorney Dkt #: | 43564-035 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/02/2021
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Application #:
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16568715
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Filing Dt:
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09/12/2019
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Publication #:
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Pub Dt:
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03/18/2021
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Title:
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FAN-OUT TRANSITION STRUCTURE FOR TRANSMISSION OF mm-WAVE SIGNALS FROM IC TO PCB VIA CHIP-SCALE PACKAGING
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Assignee
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| HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG |
| SHENZHEN, GUANGDONG, CHINA 518129 |
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Correspondence name and address
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BCF LLP
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1100 RENE-LEVESQUE BLVD WEST
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25TH FLOOR
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MONTREAL, PQC H3B 5C9
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