Patent Assignment Details
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Reel/Frame: | 014949/0052 | |
| Pages: | 3 |
| | Recorded: | 02/05/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/10/2007
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Application #:
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10695630
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Filing Dt:
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10/27/2003
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Publication #:
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Pub Dt:
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07/01/2004
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Title:
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CHIP PACKAGE WITH MULTIPLE CHIPS CONNECTED BY BUMPS
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Assignee
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21, R&D 1ST RD. |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCU, TAIWAN R.O.C. |
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Correspondence name and address
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J. C. PATENTS
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JIAWEI HUANG
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4 VENTURE, SUITE 250
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IRVINE, CA 92618
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