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Reel/Frame:	026916/0054			Pages:	7
		Recorded:	09/14/2011
Attorney Dkt #:	TESSERA 5-2-027
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 39

Patent #:	8680662	Issue Dt:	03/25/2014	Application #:	12456349	Filing Dt:	06/15/2009
Publication #:	US20090316378	Pub Dt:	12/24/2009
Title:	WAFER LEVEL EDGE STACKING

Patent #:	NONE	Issue Dt:		Application #:	12644476	Filing Dt:	12/22/2009
Publication #:	US20110147928	Pub Dt:	06/23/2011
Title:	MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE

Patent #:	7923851	Issue Dt:	04/12/2011	Application #:	12722784	Filing Dt:	03/12/2010
Publication #:	US20100230828	Pub Dt:	09/16/2010
Title:	MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CONDUCTIVE REFERENCE ELEMENT

Patent #:	8253259	Issue Dt:	08/28/2012	Application #:	12722799	Filing Dt:	03/12/2010
Publication #:	US20100232128	Pub Dt:	09/16/2010
Title:	MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND REFERENCE WIREBOND

Patent #:	8008785	Issue Dt:	08/30/2011	Application #:	12793824	Filing Dt:	06/04/2010
Publication #:	US20110147953	Pub Dt:	06/23/2011
Title:	MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE

Patent #:	9159708	Issue Dt:	10/13/2015	Application #:	12839038	Filing Dt:	07/19/2010
Publication #:	US20120013001	Pub Dt:	01/19/2012
Title:	STACKABLE MOLDED MICROELECTRONIC PACKAGES WITH AREA ARRAY UNIT CONNECTORS

Patent #:	8847376	Issue Dt:	09/30/2014	Application #:	12842587	Filing Dt:	07/23/2010
Publication #:	US20120020026	Pub Dt:	01/26/2012
Title:	MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

Patent #:	9640437	Issue Dt:	05/02/2017	Application #:	12842612	Filing Dt:	07/23/2010
Publication #:	US20120018893	Pub Dt:	01/26/2012
Title:	METHODS OF FORMING SEMICONDUCTOR ELEMENTS USING MICRO-ABRASIVE PARTICLE STREAM

Patent #:	8796135	Issue Dt:	08/05/2014	Application #:	12842651	Filing Dt:	07/23/2010
Publication #:	US20120018863	Pub Dt:	01/26/2012
Title:	MICROELECTRONIC ELEMENTS WITH REAR CONTACTS CONNECTED WITH VIA FIRST OR VIA MIDDLE STRUCTURES

Patent #:	8697569	Issue Dt:	04/15/2014	Application #:	12842669	Filing Dt:	07/23/2010
Publication #:	US20120018894	Pub Dt:	01/26/2012
Title:	NON-LITHOGRAPHIC FORMATION OF THREE-DIMENSIONAL CONDUCTIVE ELEMENTS

Patent #:	8598695	Issue Dt:	12/03/2013	Application #:	12842692	Filing Dt:	07/23/2010
Publication #:	US20120018895	Pub Dt:	01/26/2012
Title:	ACTIVE CHIP ON CARRIER OR LAMINATED CHIP HAVING MICROELECTRONIC ELEMENT EMBEDDED THEREIN

Patent #:	8791575	Issue Dt:	07/29/2014	Application #:	12842717	Filing Dt:	07/23/2010
Publication #:	US20120018868	Pub Dt:	01/26/2012
Title:	MICROELECTRONIC ELEMENTS HAVING METALLIC PADS OVERLYING VIAS

Patent #:	8580607	Issue Dt:	11/12/2013	Application #:	12844463	Filing Dt:	07/27/2010
Publication #:	US20120025365	Pub Dt:	02/02/2012
Title:	MICROELECTRONIC PACKAGES WITH NANOPARTICLE JOINING

Patent #:	8685793	Issue Dt:	04/01/2014	Application #:	12883421	Filing Dt:	09/16/2010
Publication #:	US20120068351	Pub Dt:	03/22/2012
Title:	CHIP ASSEMBLY HAVING VIA INTERCONNECTS JOINED BY PLATING

Patent #:	8686565	Issue Dt:	04/01/2014	Application #:	12883431	Filing Dt:	09/16/2010
Publication #:	US20120068352	Pub Dt:	03/22/2012
Title:	STACKED CHIP ASSEMBLY HAVING VERTICAL VIAS

Patent #:	8581377	Issue Dt:	11/12/2013	Application #:	12883556	Filing Dt:	09/16/2010
Publication #:	US20120068317	Pub Dt:	03/22/2012
Title:	TSOP WITH IMPEDANCE CONTROL

Patent #:	8222725	Issue Dt:	07/17/2012	Application #:	12883811	Filing Dt:	09/16/2010
Publication #:	US20120068365	Pub Dt:	03/22/2012
Title:	METAL CAN IMPEDANCE CONTROL STRUCTURE

Patent #:	8786083	Issue Dt:	07/22/2014	Application #:	12883821	Filing Dt:	09/16/2010
Publication #:	US20120068338	Pub Dt:	03/22/2012
Title:	IMPEDANCE CONTROLLED PACKAGES WITH METAL SHEET OR 2-LAYER RDL

Patent #:	8847380	Issue Dt:	09/30/2014	Application #:	12884649	Filing Dt:	09/17/2010
Publication #:	US20120068330	Pub Dt:	03/22/2012
Title:	STAGED VIA FORMATION FROM BOTH SIDES OF CHIP

Patent #:	8610259	Issue Dt:	12/17/2013	Application #:	12884695	Filing Dt:	09/17/2010
Publication #:	US20120068327	Pub Dt:	03/22/2012
Title:	MULTI-FUNCTION AND SHIELDED 3D INTERCONNECTS

Patent #:	8553420	Issue Dt:	10/08/2013	Application #:	12907522	Filing Dt:	10/19/2010
Publication #:	US20120092832	Pub Dt:	04/19/2012
Title:	ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND IMPROVED THERMAL CHARACTERISTICS

Patent #:	8697492	Issue Dt:	04/15/2014	Application #:	12938068	Filing Dt:	11/02/2010
Publication #:	US20120104595	Pub Dt:	05/03/2012
Title:	FLOW UNDERFILL FOR MICROELECTRONIC PACKAGE

Patent #:	8378478	Issue Dt:	02/19/2013	Application #:	12953994	Filing Dt:	11/24/2010
Publication #:	US20120126389	Pub Dt:	05/24/2012
Title:	ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS AND VIAS CONNECTED TO THE CENTRAL CONTACTS

Patent #:	8637968	Issue Dt:	01/28/2014	Application #:	12958866	Filing Dt:	12/02/2010
Publication #:	US20120139094	Pub Dt:	06/07/2012
Title:	STACKED MICROELECTRONIC ASSEMBLY HAVING INTERPOSER CONNECTING ACTIVE CHIPS

Patent #:	8610264	Issue Dt:	12/17/2013	Application #:	12962806	Filing Dt:	12/08/2010
Publication #:	US20120146210	Pub Dt:	06/14/2012
Title:	COMPLIANT INTERCONNECTS IN WAFERS

Patent #:	8432045	Issue Dt:	04/30/2013	Application #:	12963938	Filing Dt:	12/09/2010
Publication #:	US20120119367	Pub Dt:	05/17/2012
Title:	CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES

Patent #:	8502340	Issue Dt:	08/06/2013	Application #:	12964049	Filing Dt:	12/09/2010
Publication #:	US20120146182	Pub Dt:	06/14/2012
Title:	HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS

Patent #:	8853558	Issue Dt:	10/07/2014	Application #:	12965192	Filing Dt:	12/10/2010
Publication #:	US20120145442	Pub Dt:	06/14/2012
Title:	INTERCONNECT STRUCTURE

Patent #:	NONE	Issue Dt:		Application #:	12966225	Filing Dt:	12/13/2010
Publication #:	US20120146206	Pub Dt:	06/14/2012
Title:	PIN ATTACHMENT

Patent #:	8575766	Issue Dt:	11/05/2013	Application #:	12986556	Filing Dt:	01/07/2011
Publication #:	US20110095408	Pub Dt:	04/28/2011
Title:	MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CONDUCTIVE REFERENCE ELEMENT

Patent #:	8269357	Issue Dt:	09/18/2012	Application #:	12986601	Filing Dt:	01/07/2011
Publication #:	US20110101535	Pub Dt:	05/05/2011
Title:	MICROELECTRONIC ASSEMBLY WITH IMPEDANCE CONTROLLED WIREBOND AND CONDUCTIVE REFERENCE ELEMENT

Patent #:	8587126	Issue Dt:	11/19/2013	Application #:	13051414	Filing Dt:	03/18/2011
Publication #:	US20120139124	Pub Dt:	06/07/2012
Title:	STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PLURAL ACTIVE CHIPS

Patent #:	8736066	Issue Dt:	05/27/2014	Application #:	13051424	Filing Dt:	03/18/2011
Publication #:	US20120139082	Pub Dt:	06/07/2012
Title:	STACKED MICROELECTRONIC ASSEMBY WITH TSVS FORMED IN STAGES AND CARRIER ABOVE CHIP

Patent #:	8486758	Issue Dt:	07/16/2013	Application #:	13076969	Filing Dt:	03/31/2011
Publication #:	US20120153488	Pub Dt:	06/21/2012
Title:	SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING

Patent #:	8787032	Issue Dt:	07/22/2014	Application #:	13080876	Filing Dt:	04/06/2011
Publication #:	US20120155049	Pub Dt:	06/21/2012
Title:	ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS

Patent #:	8709933	Issue Dt:	04/29/2014	Application #:	13091800	Filing Dt:	04/21/2011
Publication #:	US20120267751	Pub Dt:	10/25/2012
Title:	INTERPOSER HAVING MOLDED LOW CTE DIELECTRIC

Patent #:	8841765	Issue Dt:	09/23/2014	Application #:	13092376	Filing Dt:	04/22/2011
Publication #:	US20120267777	Pub Dt:	10/25/2012
Title:	MULTI-CHIP MODULE WITH STACKED FACE-DOWN CONNECTED DIES

Patent #:	8975751	Issue Dt:	03/10/2015	Application #:	13092495	Filing Dt:	04/22/2011
Publication #:	US20120267789	Pub Dt:	10/25/2012
Title:	VIAS IN POROUS SUBSTRATES

Patent #:	8410618	Issue Dt:	04/02/2013	Application #:	13196192	Filing Dt:	08/02/2011
Publication #:	US20110285020	Pub Dt:	11/24/2011
Title:	MICROELECTRONIC ASSEMBLY WITH JOINED BOND ELEMENTS HAVING LOWERED INDUCTANCE

Assignor

TESSERA RESEARCH LLC

Exec Dt:

09/08/2011

Assignee

TESSERA, INC.

3025 ORCHARD PARKWAY

SAN JOSE, CALIFORNIA 95134

Correspondence name and address
	DARYL K. NEFF
	LERNER, DAVID, LITTENBERG, KRUMHOLZ &
	MENTLIK, LLP
	600 SOUTH AVENUE WEST
	WESTFIELD, NJ 07090

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