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Total properties:
25
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Patent #:
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Issue Dt:
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09/25/2001
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Application #:
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09345675
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Filing Dt:
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06/30/1999
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Title:
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POST-TREATMENT FOR COPPER ON PRINTED CIRCUIT BOARDS
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Patent #:
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Issue Dt:
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07/29/2003
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Application #:
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09728264
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Filing Dt:
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12/01/2000
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Publication #:
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Pub Dt:
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11/22/2001
| | | | |
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Title:
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SOLDERING FLUX
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Patent #:
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Issue Dt:
|
02/25/2003
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Application #:
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09834196
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Filing Dt:
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04/12/2001
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Publication #:
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Pub Dt:
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02/14/2002
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Title:
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LOW-RESIDUE, LOW-SOLDER-BALL FLUX
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Patent #:
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Issue Dt:
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08/30/2005
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Application #:
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10036952
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Filing Dt:
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12/21/2001
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Publication #:
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Pub Dt:
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12/12/2002
| | | | |
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Title:
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SOLDERING FLUX VEHICLE ADDITIVE AND FINE PITCH PRINTING METHOD
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Patent #:
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Issue Dt:
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11/25/2003
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Application #:
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10151741
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Filing Dt:
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05/20/2002
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Publication #:
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Pub Dt:
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11/28/2002
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Title:
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THERMAL INTERFACE MATERIAL AND HEAT SINK CONFIGURATION
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Patent #:
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Issue Dt:
|
08/29/2006
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Application #:
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10363420
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Filing Dt:
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08/15/2003
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Publication #:
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Pub Dt:
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05/12/2005
| | | | |
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Title:
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RAPID SURFACE COOLING OF SOLDER DROPLETS BY FLASH EVAPORATION
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Patent #:
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Issue Dt:
|
05/08/2007
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Application #:
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10817138
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Filing Dt:
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04/02/2004
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Publication #:
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Pub Dt:
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10/06/2005
| | | | |
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Title:
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UNDERFILL FLUXING CURATIVE
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Patent #:
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Issue Dt:
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09/08/2009
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Application #:
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10888286
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Filing Dt:
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07/09/2004
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Publication #:
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Pub Dt:
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05/19/2005
| | | | |
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Title:
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METHOD OF APPLYING A PATTERN OF PARTICLES TO A SUBSTRATE
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Patent #:
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Issue Dt:
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08/19/2008
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Application #:
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10888619
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Filing Dt:
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07/09/2004
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Publication #:
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Pub Dt:
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05/12/2005
| | | | |
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Title:
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COATING SOLDER METAL PARTICLES WITH A CHARGE DIRECTOR MEDIUM
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Patent #:
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Issue Dt:
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07/24/2007
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Application #:
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10911908
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Filing Dt:
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08/05/2004
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Publication #:
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Pub Dt:
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02/09/2006
| | | | |
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Title:
|
LOW VOIDING NO FLOW FLUXING UNDERFILL FOR ELECTRONIC DEVICES
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Patent #:
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Issue Dt:
|
05/19/2009
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Application #:
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11012457
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Filing Dt:
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12/15/2004
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Publication #:
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Pub Dt:
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08/25/2005
| | | | |
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Title:
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SOLDER PREFORMS FOR USE IN ELECTRONIC ASSEMBLY
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|
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Patent #:
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|
Issue Dt:
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08/19/2008
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Application #:
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11065764
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Filing Dt:
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02/25/2005
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Publication #:
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Pub Dt:
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08/31/2006
| | | | |
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Title:
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PREPARATION OF METALLIC PARTICLES FOR ELECTROKINETIC OR ELECTROSTATIC DEPOSITION
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Patent #:
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Issue Dt:
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03/16/2010
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Application #:
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11419128
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Filing Dt:
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05/18/2006
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Publication #:
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Pub Dt:
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11/23/2006
| | | | |
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Title:
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MASK AND METHOD FOR ELECTROKINETIC DEPOSITION AND PATTERNING PROCESS ON SUBSTRATES
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|
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Patent #:
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|
Issue Dt:
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06/28/2011
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Application #:
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11462089
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Filing Dt:
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08/03/2006
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Publication #:
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Pub Dt:
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02/07/2008
| | | | |
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Title:
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PARTICLES AND INKS AND FILMS USING THEM
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|
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Patent #:
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|
Issue Dt:
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02/16/2010
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Application #:
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11682729
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Filing Dt:
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03/06/2007
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Publication #:
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Pub Dt:
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06/28/2007
| | | | |
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Title:
|
THERMAL INTERFACE MATERIAL AND SOLDER PREFORMS
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|
|
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Patent #:
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|
Issue Dt:
|
12/29/2015
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Application #:
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11720578
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Filing Dt:
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07/25/2008
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Publication #:
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Pub Dt:
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11/27/2008
| | | | |
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Title:
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Solder Alloy
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Patent #:
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|
Issue Dt:
|
12/03/2013
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Application #:
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11857818
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Filing Dt:
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09/19/2007
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Publication #:
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Pub Dt:
|
06/19/2008
| | | | |
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Title:
|
SOLVENT SYSTEMS FOR METALS AND INKS
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Patent #:
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|
Issue Dt:
|
02/04/2014
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Application #:
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12036497
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Filing Dt:
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02/25/2008
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Publication #:
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Pub Dt:
|
07/03/2008
| | | | |
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Title:
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SOLDER ALLOY
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Patent #:
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Issue Dt:
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06/05/2012
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Application #:
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12036604
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Filing Dt:
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02/25/2008
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Publication #:
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Pub Dt:
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07/03/2008
| | | | |
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Title:
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REDUCING JOINT EMBRITTLEMENT IN LEAD-FREE SOLDERING PROCESSES
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Patent #:
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|
Issue Dt:
|
06/07/2016
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Application #:
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12052104
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Filing Dt:
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03/20/2008
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Publication #:
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Pub Dt:
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10/09/2008
| | | | |
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Title:
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ELECTRICAL CONTACTS
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Patent #:
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Issue Dt:
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11/20/2012
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Application #:
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12052166
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Filing Dt:
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03/20/2008
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Publication #:
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Pub Dt:
|
10/02/2008
| | | | |
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Title:
|
METHODS FOR PRODUCING ELECTRICAL CONDUCTORS
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Patent #:
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Issue Dt:
|
10/15/2013
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Application #:
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12175375
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Filing Dt:
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07/17/2008
|
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Publication #:
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Pub Dt:
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01/29/2009
| | | | |
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Title:
|
METHODS OF ATTACHING A DIE TO A SUBSTRATE
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Patent #:
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Issue Dt:
|
11/06/2012
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Application #:
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12175381
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Filing Dt:
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07/17/2008
|
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Publication #:
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Pub Dt:
|
03/05/2009
| | | | |
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Title:
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ELECTRICAL CONDUCTORS AND METHODS OF MAKING AND USING THEM
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Patent #:
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Issue Dt:
|
08/28/2012
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Application #:
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12191691
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Filing Dt:
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08/14/2008
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Publication #:
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Pub Dt:
|
12/04/2008
| | | | |
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Title:
|
METALLIC PARTICLES FOR ELECTROKINETIC OR ELECTROSTATIC DEPOSITION
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Patent #:
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Issue Dt:
|
02/14/2017
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Application #:
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14077995
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Filing Dt:
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11/12/2013
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Publication #:
|
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Pub Dt:
|
03/06/2014
| | | | |
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Title:
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FLUX FORMULATIONS
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