Patent Assignment Details
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Reel/Frame: | 053421/0054 | |
| Pages: | 6 |
| | Recorded: | 08/06/2020 | | |
Attorney Dkt #: | 5649-5230 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/03/2021
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Application #:
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16986760
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Filing Dt:
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08/06/2020
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Publication #:
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Pub Dt:
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04/15/2021
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Title:
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METHOD OF MODELING HIGH SPEED CHANNEL IN SEMICONDUCTOR PACKAGE, METHOD OF DESIGNING SEMICONDUCTOR PACKAGE USING THE SAME AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME
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Assignee
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129, SAMSUNG-RO |
YEONGTONG-GU |
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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Correspondence name and address
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MYERS BIGEL, P.A.
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PO BOX 37428
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RALEIGH, NC 27627
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