Patent Assignment Details
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Reel/Frame: | 028240/0056 | |
| Pages: | 4 |
| | Recorded: | 05/21/2012 | | |
Attorney Dkt #: | LPP20071784US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/09/2012
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Application #:
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11994541
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Filing Dt:
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01/03/2008
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Publication #:
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Pub Dt:
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08/21/2008
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Title:
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BONDING APPARATUS AND METHOD OF METAL PLATE
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Assignees
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148-12, DALSAN-RI, JEONGKWAN-MYEON, KIJANG-KUN |
PUSAN-CITY, KOREA, REPUBLIC OF |
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SAN 100, YONGDANG-DONG, NAM-GU |
PUKYONG NATIONAL UNIV |
BUSAN, KOREA, REPUBLIC OF |
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Correspondence name and address
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LEXYOUME IP GROUP, PLLC
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5180 PARKSTONE DRIVE, SUITE 175
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CHANTILLY, VA 20151
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