Patent Assignment Details
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Reel/Frame: | 055407/0056 | |
| Pages: | 17 |
| | Recorded: | 02/25/2021 | | |
Attorney Dkt #: | 200635 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/01/2022
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Application #:
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17066154
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Filing Dt:
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10/08/2020
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Title:
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WIRE BOND INDUCTOR STRUCTURES FOR FLIP CHIP DIES
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Assignee
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5775 MOREHOUSE DRIVE |
SAN DIEGO, CALIFORNIA 92121-1714 |
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Correspondence name and address
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SEYFARTH SHAW LLP
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2029 CENTURY PARK EAST, SUITE 3500
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LOS ANGELES, CA 90067
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09/22/2024 09:59 AM
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