Patent Assignment Details
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| Reel/Frame: | 008738/0058 | |
| Pages: | 3 |
| | Recorded: | 08/06/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/04/2000
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Application #:
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08907005
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Filing Dt:
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08/06/1997
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Title:
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METHOD FOR IMPROVING THE PLANARIZATION OF DIELECTRIC LAYER IN THE FABRICATION OF METALLIC INTERCONNECTS
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Assignee
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 3, INDUSTRY E. ROAD III |
| HSINCHU CITY,, TAIWAN R.O.C |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, ET AL.
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MR. ERNEST F. CHAPMAN
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1300 I. STREET, N.W.
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WASHINGTON, D.C. 20005
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