Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 027291/0058 | |
| Pages: | 7 |
| | Recorded: | 11/29/2011 | | |
| Attorney Dkt #: | 55383 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME FROM THIN MATERIAL AG TO THIN MATERIALS AG PREVIOUSLY RECORDED ON REEL 024794 FRAME 0617. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST. |
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Total properties:
2
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Patent #:
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Issue Dt:
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01/27/2009
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Application #:
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10536725
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Filing Dt:
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11/18/2005
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Publication #:
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Pub Dt:
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07/27/2006
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Title:
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METHOD AND DEVICE FOR MACHINING A WAFER, IN ADDITION TO A WAFER COMPRISING A SEPARATION LAYER AND A SUPPORT LAYER
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Patent #:
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Issue Dt:
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05/08/2012
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Application #:
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12359730
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Filing Dt:
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01/26/2009
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Publication #:
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Pub Dt:
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07/09/2009
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Title:
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METHOD AND DEVICE FOR MACHINING A WAFER, IN ADDITION TO A WAFER COMPRISING A SEPARATION LAYER AND A SUPPORT LAYER
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Assignee
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| ELSTERSTRASSE 23 |
| EICHNAU, GERMANY 82223 |
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Correspondence name and address
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ROYLANCE, ABRAMS, BERDO & GOODMAN, L.L.P
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1300 19TH STREET, N.W.
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SUITE 600
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WASHINGTON, DC 20036
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