Patent Assignment Details
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| Reel/Frame: | 062258/0058 | |
| Pages: | 8 |
| | Recorded: | 01/03/2023 | | |
| Attorney Dkt #: | BOXP550US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18149236
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Filing Dt:
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01/03/2023
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Publication #:
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Pub Dt:
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11/02/2023
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE
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Assignees
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| NO. 388, XINGYE AVENUE, AIRPORT INDUSTRIAL PARK |
| ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA |
| HEFEI CITY, ANHUI, CHINA 230601 |
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| ROOM 401-10, FLOOR 4, BUILDING 52, NO.2, JINGYUAN NORTH STREET |
| BEIJING ECONOMIC AND TECHNOLOGICAL DEVELOPMENT AREA |
| BEIJING, CHINA 100176 |
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Correspondence name and address
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COOPER LEGAL GROUP LLC
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1388 RIDGE ROAD, UNIT 1
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HINCKLEY, OH 44233
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