Patent Assignment Details
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| Reel/Frame: | 008045/0059 | |
| Pages: | 2 |
| | Recorded: | 06/12/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/03/1998
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Application #:
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08661876
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Filing Dt:
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06/12/1996
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Title:
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INTEGRATED CIRCUIT IC PACKAGE AND A PROCESS FOR COOLING AN INTEGRATED CIRCUIT MOUNTED IN AN IC PACKAGE
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Assignee
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| PC/LV59C18, B.P. 45 |
| 68 ROUTE DE VERSAILLES |
| LOUVECIENNES, FRANCE 78430 |
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Correspondence name and address
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KERKAM, STOWELL, KONDRACKI ET AL
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EDWARD J. KONDRACKI, ESQ.
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5203 LEESBURG PIKE
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TWO SKYLINE PLACE, SUITE 600
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FALLS CHURCH, VA 22041-3401
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