Patent Assignment Details
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| Reel/Frame: | 015730/0060 | |
| Pages: | 6 |
| | Recorded: | 02/17/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/11/2012
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Application #:
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11008593
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Filing Dt:
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12/09/2004
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Title:
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INTEGRATED CIRCUIT PACKAGE HAVING A PLURALITY OF SPACED APART PAD PORTIONS
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Assignee
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| 14TH FLOOR, 138 TEXACO ROAD |
| QPL INDUSTRIAL BUILDING |
| TSUEN WAN NEW TERRITORIES, HONG KONG |
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Correspondence name and address
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KEATING & BENNETT, LLP
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JOSEPH R. KEATING
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10400 EATON PLACE, SUITE 312
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FAIRFAX, VA 22030
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