Patent Assignment Details
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| Reel/Frame: | 023145/0060 | |
| Pages: | 2 |
| | Recorded: | 08/26/2009 | | |
| Attorney Dkt #: | 09225URL |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/20/2012
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Application #:
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12547495
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Filing Dt:
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08/26/2009
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Publication #:
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Pub Dt:
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03/03/2011
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Title:
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SOLDER PAD STRUCTURE WITH HIGH BONDABILITY TO SOLDER BALL
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Assignee
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| NO. 1245, JUNGHUA RD. |
| SHIN-WU SHIANG |
| TAOYUAN, TAIWAN |
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Correspondence name and address
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LIN & ASSOCIATES INTELLECTUAL PROPERTY,
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P.O. BOX 2339
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SARATOGA, CA 95070-0339
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