Patent Assignment Details
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Reel/Frame: | 026241/0060 | |
| Pages: | 2 |
| | Recorded: | 05/06/2011 | | |
Attorney Dkt #: | 3304.2.432 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13103021
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Filing Dt:
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05/06/2011
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Publication #:
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Pub Dt:
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03/22/2012
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Title:
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ASSEMBLED STRUCTURE OF ELECTRONIC COMPONENT AND HEAT-DISSIPATING DEVICE
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Assignee
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NO. 31-1, SHIEN PAN ROAD, KUEI SAN INDUSTRIAL ZONE |
TAOYUAN HSIEN, TAIWAN 333 |
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Correspondence name and address
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THOMAS M. HARDMAN
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170 SOUTH MAIN STREET, SUITE 735
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SALT LAKE CITY, UT 84101
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