Patent Assignment Details
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Reel/Frame: | 034528/0060 | |
| Pages: | 6 |
| | Recorded: | 12/17/2014 | | |
Attorney Dkt #: | YOR920110036US2(14-30-01) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/05/2016
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Application #:
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14525069
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Filing Dt:
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10/27/2014
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Publication #:
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Pub Dt:
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05/28/2015
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Title:
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NO FLOW UNDERFILL OR WAFER LEVEL UNDERFILL AND SOLDER COLUMNS
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Assignee
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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Correspondence name and address
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THE LAW OFFICES OF ROBERT J. EICHELBURG
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HODAFEL BUILDING, SUITE 200
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196 ACTON ROAD
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ANNAPOLIS, MD 21403
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