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Reel/Frame:	055605/0060			Pages:	21
		Recorded:	03/05/2021
Attorney Dkt #:	J-DEVICES TO ATJ
Conveyance:	CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY NAME PREVIOUSLY RECORDED AT REEL: 53597 FRAME: 184. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.

Total properties: 36

Patent #:	9059143	Issue Dt:	06/16/2015	Application #:	13075890	Filing Dt:	03/30/2011
Publication #:	US20120025367	Pub Dt:	02/02/2012
Title:	SEMICONDUCTOR DEVICE

Patent #:	8786110	Issue Dt:	07/22/2014	Application #:	13075921	Filing Dt:	03/30/2011
Publication #:	US20120074594	Pub Dt:	03/29/2012
Title:	SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Patent #:	8901754	Issue Dt:	12/02/2014	Application #:	13076555	Filing Dt:	03/31/2011
Publication #:	US20110309503	Pub Dt:	12/22/2011
Title:	SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Patent #:	NONE	Issue Dt:		Application #:	13556448	Filing Dt:	07/24/2012
Publication #:	US20130026650	Pub Dt:	01/31/2013
Title:	SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE STRUCTURE CONFIGURED BY VERTICALLY STACKING SEMICONDUCTOR DEVICES, AND MANUFACTURING METHOD THEREOF

Patent #:	8872350	Issue Dt:	10/28/2014	Application #:	13616549	Filing Dt:	09/14/2012
Publication #:	US20130200523	Pub Dt:	08/08/2013
Title:	SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Patent #:	NONE	Issue Dt:		Application #:	13778936	Filing Dt:	02/27/2013
Publication #:	US20130256865	Pub Dt:	10/03/2013
Title:	SEMICONDUCTOR MODULE

Patent #:	8897051	Issue Dt:	11/25/2014	Application #:	14052864	Filing Dt:	10/14/2013
Publication #:	US20140104953	Pub Dt:	04/17/2014
Title:	SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR PRODUCING THE SAME

Patent #:	9093393	Issue Dt:	07/28/2015	Application #:	14083834	Filing Dt:	11/19/2013
Publication #:	US20140138852	Pub Dt:	05/22/2014
Title:	SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME

Patent #:	9412685	Issue Dt:	08/09/2016	Application #:	14099288	Filing Dt:	12/06/2013
Publication #:	US20140159215	Pub Dt:	06/12/2014
Title:	SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Patent #:	9147671	Issue Dt:	09/29/2015	Application #:	14190885	Filing Dt:	02/26/2014
Publication #:	US20150243632	Pub Dt:	08/27/2015
Title:	SEMICONDUCTOR DEVICE, SEMICONDUCTOR STACKED MODULE STRUCTURE, STACKED MODULE STRUCTURE AND METHOD OF MANUFACTURING SAME

Patent #:	NONE	Issue Dt:		Application #:	14620854	Filing Dt:	02/12/2015
Publication #:	US20150243576	Pub Dt:	08/27/2015
Title:	SEMICONDUCTOR DEVICE

Patent #:	9601450	Issue Dt:	03/21/2017	Application #:	14669491	Filing Dt:	03/26/2015
Publication #:	US20150279759	Pub Dt:	10/01/2015
Title:	SEMICONDUCTOR PACKAGE

Patent #:	9418944	Issue Dt:	08/16/2016	Application #:	14739829	Filing Dt:	06/15/2015
Publication #:	US20150371915	Pub Dt:	12/24/2015
Title:	SEMICONDUCTOR PACKAGE

Patent #:	9362200	Issue Dt:	06/07/2016	Application #:	14744946	Filing Dt:	06/19/2015
Publication #:	US20150371934	Pub Dt:	12/24/2015
Title:	HEAT SINK IN THE APERTURE OF SUBSTRATE

Patent #:	9685376	Issue Dt:	06/20/2017	Application #:	14801437	Filing Dt:	07/16/2015
Publication #:	US20160027695	Pub Dt:	01/28/2016
Title:	SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Patent #:	9196507	Issue Dt:	11/24/2015	Application #:	14807193	Filing Dt:	07/23/2015
Publication #:	US20150332937	Pub Dt:	11/19/2015
Title:	SEMICONDUCTOR DEVICE, SEMICONDUCTOR STACKED MODULE STRUCTURE, STACKED MODULE STRUCTURE AND METHOD OF MANUFACTURING SAME

Patent #:	10090276	Issue Dt:	10/02/2018	Application #:	14944480	Filing Dt:	11/18/2015
Publication #:	US20160172265	Pub Dt:	06/16/2016
Title:	SEMICONDUCTOR PACKAGE TO REDUCE WARPING

Patent #:	9553052	Issue Dt:	01/24/2017	Application #:	14963970	Filing Dt:	12/09/2015
Publication #:	US20160172580	Pub Dt:	06/16/2016
Title:	MAGNETIC SHIELDING PACKAGE OF NON-VOLATILE MAGNETIC MEMORY ELEMENT

Patent #:	9627289	Issue Dt:	04/18/2017	Application #:	14964121	Filing Dt:	12/09/2015
Publication #:	US20160181194	Pub Dt:	06/23/2016
Title:	SEMICONDUCTOR DEVICE

Patent #:	NONE	Issue Dt:		Application #:	15018563	Filing Dt:	02/08/2016
Publication #:	US20160233141	Pub Dt:	08/11/2016
Title:	SEMICONDUCTOR DEVICE HAVING HEAT SINK HAVING STRESS ABSORBING PART

Patent #:	9837382	Issue Dt:	12/05/2017	Application #:	15089630	Filing Dt:	04/04/2016
Publication #:	US20160300779	Pub Dt:	10/13/2016
Title:	SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Patent #:	10256196	Issue Dt:	04/09/2019	Application #:	15198785	Filing Dt:	06/30/2016
Publication #:	US20170005044	Pub Dt:	01/05/2017
Title:	SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Patent #:	9786611	Issue Dt:	10/10/2017	Application #:	15235439	Filing Dt:	08/12/2016
Publication #:	US20160351511	Pub Dt:	12/01/2016
Title:	METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE

Patent #:	NONE	Issue Dt:		Application #:	15375241	Filing Dt:	12/12/2016
Publication #:	US20170207157	Pub Dt:	07/20/2017
Title:	METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE

Patent #:	NONE	Issue Dt:		Application #:	15409631	Filing Dt:	01/19/2017
Publication #:	US20170256453	Pub Dt:	09/07/2017
Title:	METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

Patent #:	9922931	Issue Dt:	03/20/2018	Application #:	15419091	Filing Dt:	01/30/2017
Publication #:	US20170263560	Pub Dt:	09/14/2017
Title:	Interconnect Structure, Printed Circuit Board, Semiconductor Device, and Manufacturing Method for Interconnect Structure

Patent #:	10134710	Issue Dt:	11/20/2018	Application #:	15422981	Filing Dt:	02/02/2017
Publication #:	US20170148766	Pub Dt:	05/25/2017
Title:	SEMICONDUCTOR PACKAGE

Patent #:	NONE	Issue Dt:		Application #:	15585659	Filing Dt:	05/03/2017
Publication #:	US20170373012	Pub Dt:	12/28/2017
Title:	SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SAME

Patent #:	10157760	Issue Dt:	12/18/2018	Application #:	15600082	Filing Dt:	05/19/2017
Publication #:	US20170338136	Pub Dt:	11/23/2017
Title:	SEMICONDUCTOR MANUFACTURING APPARATUS HAVING A PICKUP UNIT SIMULTANEOSLY PICKING UP A PLURALITY OF SEMICONDUCTOR CHIPS

Patent #:	NONE	Issue Dt:		Application #:	15621493	Filing Dt:	06/13/2017
Publication #:	US20170358462	Pub Dt:	12/14/2017
Title:	MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

Patent #:	10224256	Issue Dt:	03/05/2019	Application #:	15625464	Filing Dt:	06/16/2017
Publication #:	US20170365534	Pub Dt:	12/21/2017
Title:	MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

Patent #:	10236231	Issue Dt:	03/19/2019	Application #:	15640071	Filing Dt:	06/30/2017
Publication #:	US20170301599	Pub Dt:	10/19/2017
Title:	SEMICONDUCTOR DEVICE

Patent #:	10079161	Issue Dt:	09/18/2018	Application #:	15884979	Filing Dt:	01/31/2018
Publication #:	US20180174975	Pub Dt:	06/21/2018
Title:	METHOD FOR PRODUCING A SEMICONDUCTOR PACKAGE

Patent #:	11488886	Issue Dt:	11/01/2022	Application #:	16592213	Filing Dt:	10/03/2019
Publication #:	US20200035582	Pub Dt:	01/30/2020
Title:	SEMICONDUCTOR DEVICE

Patent #:	11367664	Issue Dt:	06/21/2022	Application #:	16720603	Filing Dt:	12/19/2019
Publication #:	US20210193539	Pub Dt:	06/24/2021
Title:	SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

Patent #:	11362041	Issue Dt:	06/14/2022	Application #:	16720686	Filing Dt:	12/19/2019
Publication #:	US20210193587	Pub Dt:	06/24/2021
Title:	SEMICONDUCTOR DEVICES INCLUDING SHIELDING LAYER AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

Assignor

J-DEVICES CORPORATION

Exec Dt:

01/01/2020

Assignee

AMKOR TECHNOLOGY JAPAN, INC.

1913-2, TAKEGASHITA, FUKURA

USUKI-SHI

OITA, JAPAN 875-0053

Correspondence name and address
	KENNETH COOL
	558 CASTLE PINES PARKWAY
	B4-362
	CASTLE PINES, CO 80108

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