Patent Assignment Details
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| Reel/Frame: | 016109/0061 | |
| Pages: | 2 |
| | Recorded: | 12/20/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/20/2007
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Application #:
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11015106
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Filing Dt:
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12/20/2004
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Publication #:
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Pub Dt:
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06/22/2006
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Title:
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HEAT-DISSIPATING MODULE
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Assignee
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| NO. 248-27, HSIN CHIEN ROAD, |
| CHIEN ZHEN DISRTICT |
| KAOHSIUNG, TAIWAN 806 |
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Correspondence name and address
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G. LINK CO., LTD.
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831 WEST 75TH STREET, SUITE 137
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PMB 174
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NAPERVILLE, IL 60565
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