Patent Assignment Details
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| Reel/Frame: | 015446/0063 | |
| Pages: | 3 |
| | Recorded: | 06/04/2004 | | |
| Attorney Dkt #: | 61471 (71987) |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10861544
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Filing Dt:
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06/04/2004
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Publication #:
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Pub Dt:
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09/15/2005
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Title:
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Semiconductor package with heat sink and method for fabricating the same and stiffener
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Assignee
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, HSIEN R.O.C., TAIWAN |
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Correspondence name and address
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EDWARDS & ANGELL, LLP
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PETER F. CORLESS
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P.O. BOX 55874
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BOSTON, MA 02205
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