Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 064356/0063 | |
| Pages: | 8 |
| | Recorded: | 07/21/2023 | | |
| Attorney Dkt #: | 02002GEN |
| Conveyance: | ABSORPTION-TYPE COMPANY SPLIT |
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Total properties:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17612758
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Filing Dt:
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11/19/2021
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Publication #:
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Pub Dt:
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09/15/2022
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Title:
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INSERT MOLDING RESIN COMPOSITION, ELECTRONIC COMPONENT-SEALING PRODUCT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT-SEALING PRODUCT
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17765250
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Filing Dt:
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03/30/2022
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Publication #:
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Pub Dt:
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11/03/2022
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Title:
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LAYERED BODY
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Assignee
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| OSAKA UMEDA TWIN TOWERS SOUTH, |
| 13-1, UMEDA 1-CHOME, KITA-KU, OSAKA-SHI |
| OSAKA, JAPAN 5300001 |
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Correspondence name and address
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WENDEROTH, LIND & PONACK L.L.P
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1025 CONNECTICUT AVENUE NW
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SUITE 500
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WASHINGTON, DC 20036
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