Patent Assignment Details
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| Reel/Frame: | 060780/0065 | |
| Pages: | 5 |
| | Recorded: | 08/11/2022 | | |
| Attorney Dkt #: | ST MALTA TO STI |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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02/09/2016
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Application #:
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14032075
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Filing Dt:
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09/19/2013
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Publication #:
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Pub Dt:
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04/03/2014
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Title:
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SURFACE MOUNT PACKAGE FOR A SEMICONDUCTOR INTEGRATED DEVICE, RELATED ASSEMBLY AND MANUFACTURING PROCESS
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Patent #:
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Issue Dt:
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09/20/2016
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Application #:
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14288130
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Filing Dt:
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05/27/2014
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Publication #:
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Pub Dt:
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12/04/2014
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Title:
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WAFER-LEVEL PACKAGING OF INTEGRATED DEVICES, AND MANUFACTURING METHOD THEREOF
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Assignee
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| CHEMIN DU CHAMP-DES-FILLES 39 |
| 1228 PLAN-LES-OUATES |
| GENEVA, SWITZERLAND |
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Correspondence name and address
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STMICROELECTRONICS, INC.
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750 CANYON DRIVE
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SUITE 300
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COPPELL, TX 75019
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